EP1C3XXB vs EP1C3T100C8N Comparison

Detailed side-by-side comparison of EP1C3XXB by Intel and EP1C3T100C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP1C3XXB EP1C3T100C8N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $0.00 $14.20
Manufacturer Intel (formerly Altera) —
Series Cyclone FPGA family —
Device Density Tier Cyclone EP1C3 (lowest density) —
Product Type FPGA - Field Programmable Gate Array —
Logic Elements [DATA_NEEDED: logic elements count] 2,910
Total RAM Bits [DATA_NEEDED: embedded memory size] 59,904
Maximum User I/O [DATA_NEEDED: user I/O count] —
Package Type FBGA (Fine-pitch Ball Grid Array) —
Package Pin Count [DATA_NEEDED: BGA ball count] —
Mounting Type Surface Mount Surface Mount
Operating Temperature [DATA_NEEDED: industrial/commercial grade] 0C to +85C (Commercial)
Supply Voltage [DATA_NEEDED: core and I/O voltage] —
Process Technology [DATA_NEEDED: CMOS process node] 130 nm CMOS
Configuration Method [DATA_NEEDED: SRAM-based configuration] —
Design Software Intel Quartus II / Quartus Prime —
RoHS Status [DATA_NEEDED: RoHS compliance status] Compliant (lead-free, 'N' suffix)
MSL Level [DATA_NEEDED: moisture sensitivity level] 3 (168 hours)
Family — Cyclone
Logic Array Blocks (LABs) — 291
Embedded RAM Blocks — 13 x M4K (4 Kbit each)
Maximum User I/Os — 65
PLLs — 1
Operating Frequency (max) — 275 MHz
Core Voltage — 1.425 V to 1.575 V
Package — TQFP-100 (100-pin Thin Quad Flat Pack), 16 x 16 mm, 0.5 mm pitch
Configuration Interface — Passive Serial (PS), Fast Passive Parallel (FPP), JTAG

Datasheets & Resources

Browse All Products Create BOM Request Quote