EP1C3XXB vs EP1C3T100C8N 对比
详细并排对比 EP1C3XXB 出自 Intel 和 EP1C3T100C8N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP1C3XXB | EP1C3T100C8N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $0.00 | $14.20 |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Cyclone FPGA family | — |
| Device Density Tier | Cyclone EP1C3 (lowest density) | — |
| Product Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements | [DATA_NEEDED: logic elements count] | 2,910 |
| Total RAM Bits | [DATA_NEEDED: embedded memory size] | 59,904 |
| Maximum User I/O | [DATA_NEEDED: user I/O count] | — |
| Package Type | FBGA (Fine-pitch Ball Grid Array) | — |
| Package Pin Count | [DATA_NEEDED: BGA ball count] | — |
| 安装类型 | Surface Mount | Surface Mount |
| 工作温度 | [DATA_NEEDED: industrial/commercial grade] | 0C to +85C (Commercial) |
| 电源电压 | [DATA_NEEDED: core and I/O voltage] | — |
| Process Technology | [DATA_NEEDED: CMOS process node] | 130 nm CMOS |
| Configuration Method | [DATA_NEEDED: SRAM-based configuration] | — |
| Design Software | Intel Quartus II / Quartus Prime | — |
| RoHS 状态 | [DATA_NEEDED: RoHS compliance status] | Compliant (lead-free, 'N' suffix) |
| MSL 等级 | [DATA_NEEDED: moisture sensitivity level] | 3 (168 hours) |
| Family | — | Cyclone |
| Logic Array Blocks (LABs) | — | 291 |
| Embedded RAM Blocks | — | 13 x M4K (4 Kbit each) |
| Maximum User I/Os | — | 65 |
| PLLs | — | 1 |
| Operating Frequency (max) | — | 275 MHz |
| Core Voltage | — | 1.425 V to 1.575 V |
| 封装 | — | TQFP-100 (100-pin Thin Quad Flat Pack), 16 x 16 mm, 0.5 mm pitch |
| Configuration Interface | — | Passive Serial (PS), Fast Passive Parallel (FPP), JTAG |