EP1C3XXB vs EP1C3T100C8N Vergleich

Detaillierter Direktvergleich von EP1C3XXB von Intel und EP1C3T100C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP1C3XXB EP1C3T100C8N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $0,00 $14,20
Manufacturer Intel (formerly Altera) —
Series Cyclone FPGA family —
Device Density Tier Cyclone EP1C3 (lowest density) —
Product Type FPGA - Field Programmable Gate Array —
Logic Elements [DATA_NEEDED: logic elements count] 2,910
Total RAM Bits [DATA_NEEDED: embedded memory size] 59,904
Maximum User I/O [DATA_NEEDED: user I/O count] —
Package Type FBGA (Fine-pitch Ball Grid Array) —
Package Pin Count [DATA_NEEDED: BGA ball count] —
Montageart Surface Mount Surface Mount
Betriebstemperatur [DATA_NEEDED: industrial/commercial grade] 0C to +85C (Commercial)
Versorgungsspannung [DATA_NEEDED: core and I/O voltage] —
Process Technology [DATA_NEEDED: CMOS process node] 130 nm CMOS
Configuration Method [DATA_NEEDED: SRAM-based configuration] —
Design Software Intel Quartus II / Quartus Prime —
RoHS-Status [DATA_NEEDED: RoHS compliance status] Compliant (lead-free, 'N' suffix)
MSL-Level [DATA_NEEDED: moisture sensitivity level] 3 (168 hours)
Family — Cyclone
Logic Array Blocks (LABs) — 291
Embedded RAM Blocks — 13 x M4K (4 Kbit each)
Maximum User I/Os — 65
PLLs — 1
Operating Frequency (max) — 275 MHz
Core Voltage — 1.425 V to 1.575 V
Gehäuse — TQFP-100 (100-pin Thin Quad Flat Pack), 16 x 16 mm, 0.5 mm pitch
Configuration Interface — Passive Serial (PS), Fast Passive Parallel (FPP), JTAG

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