EP1C4F324C7 vs EP1C4F324C6 Comparison
Detailed side-by-side comparison of EP1C4F324C7 by Intel and EP1C4F324C6 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP1C4F324C7 | EP1C4F324C6 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $46.80 | $16.75 |
| Device Type | FPGA (Field-Programmable Gate Array) | — |
| Series | Cyclone | Cyclone |
| Logic Elements | 4 000 | — |
| Logic Array Blocks / CLBs | 400 CLBs | — |
| Embedded Memory (Bits) | 78 336 | — |
| Maximum User I/O | 249 | 249 |
| Package | 324-FBGA, 19 × 19 mm, 1.0 mm pitch, lead-free | — |
| Core Supply Voltage | 1.5 V | — |
| Internal Frequency (max, family ref) | 405 MHz | — |
| Operating Temperature | Commercial (0 °C to +85 °C) inferred from speed grade C7 | 0C to +85C (commercial, C6 suffix) |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Process Technology | CMOS, 130 nm-class (Cyclone generation) | 130 nm |
| RoHS Status | Compliant (lead-free FBGA) | Compliant |
| MSL Level | 3 (per JEDEC J-STD-020, typical for BGA-324) | — |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements (LE) | — | 4,000 |
| Total RAM Bits | — | 78,336 |
| Number of I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| PLLs | — | 2 |
| Core Voltage (VCCINT) | — | 1.5 V |
| I/O Voltage (VCCIO) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| Maximum Internal Frequency | — | 405.2 MHz |
| Package Type | — | 324-ball FineLine BGA (FBGA) |
| Configuration Method | — | Serial / JTAG |