EP1C4F324C7 vs EP1C4F324C6 Vergleich
Detaillierter Direktvergleich von EP1C4F324C7 von Intel und EP1C4F324C6 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP1C4F324C7 | EP1C4F324C6 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $46,80 | $16,75 |
| Device Type | FPGA (Field-Programmable Gate Array) | — |
| Series | Cyclone | Cyclone |
| Logic Elements | 4 000 | — |
| Logic Array Blocks / CLBs | 400 CLBs | — |
| Embedded Memory (Bits) | 78 336 | — |
| Maximum User I/O | 249 | 249 |
| Gehäuse | 324-FBGA, 19 × 19 mm, 1.0 mm pitch, lead-free | — |
| Core Supply Voltage | 1.5 V | — |
| Internal Frequency (max, family ref) | 405 MHz | — |
| Betriebstemperatur | Commercial (0 °C to +85 °C) inferred from speed grade C7 | 0C to +85C (commercial, C6 suffix) |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Process Technology | CMOS, 130 nm-class (Cyclone generation) | 130 nm |
| RoHS-Status | Compliant (lead-free FBGA) | Compliant |
| MSL-Level | 3 (per JEDEC J-STD-020, typical for BGA-324) | — |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements (LE) | — | 4,000 |
| Total RAM Bits | — | 78,336 |
| Number of I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| PLLs | — | 2 |
| Core Voltage (VCCINT) | — | 1.5 V |
| I/O Voltage (VCCIO) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| Maximum Internal Frequency | — | 405.2 MHz |
| Package Type | — | 324-ball FineLine BGA (FBGA) |
| Configuration Method | — | Serial / JTAG |