EP1C4F324C7 vs EP1C4F324C6 Comparación
Comparación detallada lado a lado de EP1C4F324C7 por Intel y EP1C4F324C6 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1C4F324C7 | EP1C4F324C6 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $46,80 | $16,75 |
| Device Type | FPGA (Field-Programmable Gate Array) | — |
| Series | Cyclone | Cyclone |
| Logic Elements | 4 000 | — |
| Logic Array Blocks / CLBs | 400 CLBs | — |
| Embedded Memory (Bits) | 78 336 | — |
| Maximum User I/O | 249 | 249 |
| Encapsulado | 324-FBGA, 19 × 19 mm, 1.0 mm pitch, lead-free | — |
| Core Supply Voltage | 1.5 V | — |
| Internal Frequency (max, family ref) | 405 MHz | — |
| Temperatura de funcionamiento | Commercial (0 °C to +85 °C) inferred from speed grade C7 | 0C to +85C (commercial, C6 suffix) |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Process Technology | CMOS, 130 nm-class (Cyclone generation) | 130 nm |
| Estado RoHS | Compliant (lead-free FBGA) | Compliant |
| Nivel MSL | 3 (per JEDEC J-STD-020, typical for BGA-324) | — |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements (LE) | — | 4,000 |
| Total RAM Bits | — | 78,336 |
| Number of I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| PLLs | — | 2 |
| Core Voltage (VCCINT) | — | 1.5 V |
| I/O Voltage (VCCIO) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| Maximum Internal Frequency | — | 405.2 MHz |
| Package Type | — | 324-ball FineLine BGA (FBGA) |
| Configuration Method | — | Serial / JTAG |