EP1C4F324C7 vs EP1C4F324C7N Comparison
Detailed side-by-side comparison of EP1C4F324C7 by Intel and EP1C4F324C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP1C4F324C7 | EP1C4F324C7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | NRND |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $46.80 | $25.75 |
| Device Type | FPGA (Field-Programmable Gate Array) | — |
| Series | Cyclone | — |
| Logic Elements | 4 000 | 4000 |
| Logic Array Blocks / CLBs | 400 CLBs | 249 LABs |
| Embedded Memory (Bits) | 78 336 | — |
| Maximum User I/O | 249 | — |
| Package | 324-FBGA, 19 × 19 mm, 1.0 mm pitch, lead-free | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Internal Frequency (max, family ref) | 405 MHz | — |
| Operating Temperature | Commercial (0 °C to +85 °C) inferred from speed grade C7 | 0C to +85C (commercial) |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG | Passive Serial, Active Serial, JTAG |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Process Technology | CMOS, 130 nm-class (Cyclone generation) | 0.13 um SRAM-based CMOS |
| RoHS Status | Compliant (lead-free FBGA) | Compliant (lead-free FBGA) |
| MSL Level | 3 (per JEDEC J-STD-020, typical for BGA-324) | — |
| Device Family | — | Cyclone |
| Total RAM Bits | — | 78336 bits (~9.6 KB) |
| Maximum User I/Os | — | 249 |
| PLLs | — | 2 |
| Package Type | — | FBGA-324 (FineLine BGA) |
| Package Dimensions | — | 19 x 19 mm, 1.0 mm ball pitch |
| Speed Grade | — | C7 (commercial, mid-speed) |
| Internal Frequency (max) | — | 405 MHz |
| Embedded Multipliers | — | Yes (DSP blocks) |