EP1C6F256C8N vs EP1C6F256C7N Comparison

Detailed side-by-side comparison of EP1C6F256C8N by Intel and EP1C6F256C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP1C6F256C8N EP1C6F256C8N - Cyclone FPGA 6K LE 256-BGA | Intel

EP1C6F256C8N - Cyclone FPGA 6K LE 256-BGA | Intel

EP1C6F256C8N ⚠ Last Time Buy

Specification Comparison

Parameter EP1C6F256C8N EP1C6F256C7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last Time Buy Active
Stock Status In Stock In Stock
Unit Price (USD) $21.40 $18.20
Series Cyclone Cyclone
Family Cyclone I —
Logic Elements (LEs) 5,980 —
Embedded Memory (bits) 92,160 —
User I/O Pins 185 —
Number of PLLs 2 2
Core Voltage (VCCINT) 1.5 V —
Operating Temperature 0 °C to +85 °C (Commercial) 0C to +85C (commercial)
Speed Grade 8 -7 (C7)
Package 256-BGA (FBGA-256), 17 × 17 mm, 1.0 mm pitch —
Mounting Type Surface Mount Surface Mount
Process Node 0.13 µm SRAM —
Configuration Modes Passive Serial (PS), Active Serial (AS), JTAG —
I/O Standards Supported LVTTL, LVCMOS, SSTL, LVDS —
RoHS Status Compliant Compliant
MSL Level 3 —
Manufacturer — Intel (formerly Altera)
Logic Elements (LE) — 5,980
Total RAM Bits — 92,160
User I/O Count — 185
Number of Logic Array Blocks (LAB) — [DATA_NEEDED: LAB count]
Embedded Multipliers (18x18) — [DATA_NEEDED: multiplier count]
Core Voltage — 1.5 V
Process Technology — 0.13 µm SRAM, all-layer copper
Package Type — 256-ball FineLine BGA (FBGA-256)
Package Dimensions — 17 mm x 17 mm
Configuration Mode — Passive Serial (PS), Active Serial (AS), JTAG
Lead-Free — Yes

Datasheets & Resources

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