EP1K100FI256-2N vs EP1K100FI256-3 Comparison

Detailed side-by-side comparison of EP1K100FI256-2N by Intel and EP1K100FI256-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP1K100FI256-2N EP1K100FI256-3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Last Time Buy
Family ACEX 1K ACEX 1K
Series EP1K100 —
Logic Elements 4,992 —
System Gates 100,000 —
Logic Array Blocks (LABs) 624 —
Embedded Array Blocks (EABs) 6 —
Total RAM Bits 49,152 —
Maximum User I/O 186 —
Process Technology 0.22 µm CMOS 0.22 micron CMOS
Core Supply Voltage 2.5 V —
I/O Supply Voltage 2.5 V / 3.3 V / 5.0 V (MultiVolt) —
Speed Grade -2 (faster bin) -3
Ball Finish Leaded (SnPb) - 'N' suffix —
Operating Temperature -40 °C to +85 °C (Industrial) —
Package 256-ball FineLine BGA (FBGA-256) 256-ball FineLine BGA (FBGA-256)
Mounting Type Surface Mount Surface Mount
Configuration Interface JTAG (IEEE 1149.1) + serial modes —
RoHS Status Non-compliant (leaded 'N' ball finish) [DATA_NEEDED: RoHS status]
Device Logic Elements — 4,992
Typical Gate Count — 100,000 gates
Maximum RAM Bits — 49,152 bits
User I/O Pins — 186
Dedicated Inputs — 6
Nominal Core Voltage — 2.5 V
Core Voltage Range — 2.375 V to 2.625 V
Operating Temperature Range — -40 C to +85 C (Industrial)
Configuration Method — SRAM-based, JTAG / PS / AS supported
Lead-Free — [DATA_NEEDED: lead-free status]
AEC-Q100 Qualification — Not qualified
MSL Level — [DATA_NEEDED: MSL level]
JTAG Boundary Scan — Yes (IEEE 1149.1)

Datasheets & Resources

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