EP1K10FI256-2N vs EP1K10FC256-2N Comparison

Detailed side-by-side comparison of EP1K10FI256-2N by Intel and EP1K10FC256-2N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP1K10FI256-2N EP1K10FI256-2N - 10K Gates ACEX 1K FPGA 256-FBGA | Intel

EP1K10FI256-2N - 10K Gates ACEX 1K FPGA 256-FBGA | Intel

EP1K10FI256-2N ⚠ Last Time Buy

Specification Comparison

Parameter EP1K10FI256-2N EP1K10FC256-2N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last Time Buy Last Time Buy
Family ACEX 1K —
Logic Elements (Cells) 576 —
Typical Gates 10,000 10,000
Embedded Array Blocks (EABs) 3 (12,288 RAM bits) —
Total RAM Bits 12,288 12,288
User I/O Count 136 —
Core Voltage 2.5 V —
Process Technology 0.22 µm CMOS —
Speed Grade -2 —
Maximum Internal Frequency 200 MHz —
Package 256-Ball FBGA (FineLine BGA, 1.0 mm pitch) —
Operating Temperature -40 °C to +85 °C (Industrial) 0 °C to +70 °C (Commercial)
Configuration Modes Passive Serial (PS), Active Serial (AS), JTAG —
Mounting Type Surface Mount Surface Mount
RoHS Status [DATA_NEEDED: RoHS compliance status] ROHS3 Compliant
MSL Level [DATA_NEEDED: moisture sensitivity level] —
Series — ACEX-1K
Family Name — ACEX-1K
Device Type — Field Programmable Gate Array (FPGA)
Logic Elements / Cells — 576
Number of LABs/CLBs — 72
Number of I/O — 136
Number of Gates — 56,000 (maximum)
Core Supply Voltage — 2.375 V to 2.625 V
Pin-to-Pin Logic Delay — 0.5 ns
Package / Case — 256-BBGA (FineLine BGA, 17 mm × 17 mm)
Supplier Device Package — 256-FBGA
Lead Time — To be confirmed by distributor

Datasheets & Resources

Browse All Products Create BOM Request Quote