EP1K10FI256-2N - 10K Gates ACEX 1K FPGA 256-FBGA | Intel
MPN: EP1K10FI256-2N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.4 | $254.00 |
| 100 | $22.1 | $2,210.00 |
| 500 | $19.8 | $9,900.00 |
| 1,000 | $17.95 | $17,950.00 |
Drop-in alternatives for EP1K10FI256-2N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1K10FI256-2
✅ Drop-In✓ In Stock
$10.4 / Unit
View Datasheet →EP1K10FC256-2N
✅ Drop-In✓ In Stock
$5.62 / Unit
View Datasheet →EP1K10FC256-2
✅ Drop-In✓ In Stock
$9.95 / Unit
View Datasheet →EP1K10FC256-1N
✅ Drop-In📋 Reference alternative (not in catalog)
EP1K10FC256-3N
✅ Drop-In✓ In Stock
$24.5 / Unit
View Datasheet →EP1K10FI256-2N Maximum Ratings & Electrical Characteristics
| Family | ACEX 1K |
| Logic Elements (Cells) | 576 |
| Typical Gates | 10,000 |
| Embedded Array Blocks (EABs) | 3 (12,288 RAM bits) |
| Total RAM Bits | 12,288 |
| User I/O Count | 136 |
| Core Voltage | 2.5 V |
| Process Technology | 0.22 µm CMOS |
| Speed Grade | -2 |
| Maximum Internal Frequency | 200 MHz |
| Package | 256-Ball FBGA (FineLine BGA, 1.0 mm pitch) |
| Operating Temperature | -40 °C to +85 °C (Industrial) |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG |
| Mounting Type | Surface Mount |
EP1K10FI256-2N 256-ball fbga (fineline bga, 1.0 mm pitch) Pin Configuration Guide
Complete pinout information for EP1K10FI256-2N (256-ball fbga (fineline bga, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1K10FI256-2N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1K10FI256-2N is suitable for 6 applications: Industrial Control Glue Logic, Telecommunications Line-Card Interface, Legacy DSP Co-Processor, Automotive Telematics Interface, Test & Measurement Instrumentation, Medical Device Data Acquisition.
Industrial Control Glue Logic
The EP1K10FI256-2N's 576 logic elements, 136 user I/O, and industrial temperature grade (-40 °C to +85 °C) make it well-suited for industrial control glue logic. The device integrates discrete TTL/CMOS buffers, address decoding, and custom state machines that traditionally required multiple 74-series logic ICs, reducing board area by 60–70% in typical PLC and motor-control designs. Industrial temperature grade ensures reliable operation in factory-floor enclosures with ambient temperatures from 0 °C to 70 °C and brief excursions beyond. The 2.5 V core plus 3.3 V/5 V tolerant I/O banks enable direct interfacing with legacy 5 V logic and modern 3.3 V microcontrollers without level shifters. ACEX 1K dual-port EAB RAM provides deterministic cycle sharing for sensor-data buffering between an ADC and DSP.
Recommended
Telecommunications Line-Card Interface
Telecommunications line cards use the EP1K10FI256-2N to implement serial-protocol bridging (HDLC, UART, I2C) and TDM bus aggregation between framer ICs and network processors. The 12,288 bits of dual-port RAM in three EABs allow clock-domain crossing between the TDM backplane (typically 8.192 MHz) and the host processor bus without external FIFOs. The -2 speed grade supports 200 MHz internal operation, sufficient for oversampled DSL front-end processing. 136 user I/O accommodate LVTTL signalling to multiple framers and LIU (line interface unit) devices. Industrial temperature rating permits deployment in carrier-grade outdoor cabinets.
Recommended
Legacy DSP Co-Processor
In legacy DSP designs, the EP1K10FI256-2N serves as a co-processor implementing custom FIR/IIR filters, FFT butterflies, and CRC engines alongside a host DSP or microcontroller. Each EAB can be configured as 4 Kbit dual-port RAM for coefficient storage, while the 576 logic elements deliver approximately 25–40 GMACs/s of 8-bit multiply-accumulate throughput using embedded multiplier soft-logic. The dual-port EAB memory enables concurrent coefficient read and data write in pipelined filter architectures. Designers use the Quartus or MAX+PLUS II toolchain to map DSP algorithms onto the FPGA fabric. ACEX 1K is software-compatible with later Cyclone families, easing migration paths.
Recommended
Automotive Telematics Interface
Automotive telematics modules use the EP1K10FI256-2N for CAN/LIN bus aggregation, GPS data parsing, and protocol translation between in-vehicle networks and external cellular modems. With 136 I/O and industrial temperature operation, the device handles multiple CAN 2.0B channels, LIN master/slave stacks, and UART bridges concurrently. The 12,288 bits of dual-port EAB RAM provide message buffering between the bus controllers and host MCU without external SRAM. 5 V-tolerant I/O banks interface directly with automotive transceivers like the TJA1050. ACEX 1K devices have a long history of deployment in automotive aftermarket telematics.
Recommended
Test & Measurement Instrumentation
Test and measurement equipment uses the EP1K10FI256-2N for custom stimulus generation, protocol decoding, and timing-critical sequencing. The 200 MHz internal frequency and -2 speed grade allow precise pulse generation down to 5 ns resolution, suitable for bench-top instrumentation and ATE systems. EAB dual-port memory stores pre-defined waveform tables for arbitrary waveform generators. The 136 I/O accommodate parallel stimulus buses (up to 34 bits at LVTTL) plus isolated trigger/handshake signals. Industrial temperature grade supports operation in calibration labs with varying ambient conditions. Engineers benefit from JTAG-based in-system reprogrammability during test development.
Recommended
Medical Device Data Acquisition
Medical data-acquisition front-ends use the EP1K10FI256-2N to interface multiple physiological sensors (ECG, SpO2, temperature) with a host processor via serial protocols. The 12,288 bits of dual-port EAB RAM act as a sample buffer between high-speed ADC conversion and slower host read cycles, eliminating dropped samples in continuous monitoring applications. 136 user I/O support parallel ADC interfaces plus isolated SPI/I2C connections to sensor front-ends. Industrial temperature grade permits deployment in bedside monitors with stable thermal environments. Note: medical applications requiring IEC 60601 compliance must validate the entire system, not just the FPGA.
Recommended
Recommended Products Summary
Engineering reference data for EP1K10FI256-2N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K10FI256-2 | EP1K10FC256-2N | EP1K10FC256-2 | EP1K10FC256-1N | EP1K10FC256-3N |
|---|---|---|---|---|---|---|
| Package | 256-Ball FBGA | 256-Ball FBGA | 256-Ball FBGA | 256-Ball FBGA | 256-Ball FBGA | 256-Ball FBGA |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 576 | 576 | 576 | 576 | 576 | 576 |
| Typical Gates | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 |
| Speed Grade | -2 | -2 | -2 | -2 | -1 (slower) | -3 (faster) |
| Temperature Grade | Industrial (-40 °C to +85 °C) | Industrial (-40 °C to +85 °C) | Commercial (0 °C to +70 °C) | Commercial (0 °C to +70 °C) | Commercial (0 °C to +70 °C) | Commercial (0 °C to +70 °C) |
| User I/O | 136 | 136 | 136 | 136 | 136 | 136 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Embedded RAM (bits) | 12,288 | 12,288 | 12,288 | 12,288 | 12,288 | 12,288 |
Key Differentiators
- Industrial temperature grade in same ACEX 1K 256-FBGA footprint (vs EP1K10FC256-2N)
- -2 speed grade balance between performance and power (vs EP1K10FC256-1N)
- ACEX 1K dual-port EAB architecture for clock-domain crossing (vs EP1K10FC256-3N)
Design Notes
The EP1K10FI256-2N requires a clean 2.5 V supply on VCCINT with ±5 % tolerance. Recommended: a low-dropout regulator (e.g., LT1764-2.5) with at least 200 mA headroom above the FPGA's worst-case Icc. Add bulk 22 µF tantalum plus 0.1 µF ceramic decoupling adjacent to every VCCINT ball. VCCIO banks may be powered at 2.5 V, 3.3 V, or 5.0 V independently to support mixed-voltage I/O standards; selected 5 V-tolerant banks allow direct interfacing with legacy TTL logic without level shifters. Power sequencing is not required between VCCINT and VCCIO for ACEX 1K.
The 256-ball FineLine BGA (1.0 mm pitch) demands a 4–6 layer PCB with continuous power planes beneath the device for thermal dissipation and signal return paths. Escape routing on the top layer uses 0.2 mm (8 mil) traces and 0.2 mm laser-drilled vias with via-in-pad recommended for high-density signal escape. Maintain at least 0.8 mm clearance between BGA balls and any adjacent components. Place configuration EEPROM (EPCS1 or compatible) within 50 mm of the FPGA to meet passive-serial configuration timing. A solid ground pour directly under the BGA improves signal integrity for high-speed I/O.
Common pitfalls when designing with the EP1K10FI256-2N: (1) Do not connect 5 V signals to non-5 V-tolerant I/O banks — check the bank VCCIO voltage before connecting any signal above 3.3 V. (2) Configure MSEL pins correctly for the intended configuration mode; a wrong setting prevents the FPGA from configuring. (3) Provide adequate decoupling on nCONFIG and nSTATUS; floating or noisy signals cause configuration failure. (4) Industrial temperature grade parts may not be available in last-time-buy inventory — place safety stock or migrate to a current-generation Cyclone IV/Cyclone 10 device for new designs.
Compliance Information
Compliance information not explicitly stated in provided web data; RoHS and lead-free status depend on whether the -N suffix is interpreted as Pb-free per ACEX 1K ordering code conventions. AEC-Q100 not applicable — ACEX 1K is not automotive-qualified.
