EP1K10FC256-2N - 10K Gate ACEX-1K FPGA 576 LE 256-BGA | Intel / Altera
MPN: EP1K10FC256-2N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $23.48 | $23.48 |
| 10 | $19.96 | $199.60 |
| 100 | $13.95 | $1,395.00 |
| 500 | $8.5 | $4,250.00 |
| 1,000 | $5.62 | $5,620.00 |
Drop-in alternatives for EP1K10FC256-2N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1K10FC256-2
✅ Drop-In✓ In Stock
$9.95 / Unit
View Datasheet →EP1K10FC256-1
✅ Drop-In✓ In Stock
$22.62 / Unit
View Datasheet →EP1K10FC256-3N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$24.5 / Unit
View Datasheet →EP1K10FI256-2N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$17.95 / Unit
View Datasheet →EP1K10FC256-2NGZ
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP1K10FC256-1N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP1K10FC256-2N Maximum Ratings & Electrical Characteristics
| Series | ACEX-1K |
| Family Name | ACEX-1K |
| Device Type | Field Programmable Gate Array (FPGA) |
| Typical Gates | 10,000 |
| Logic Elements / Cells | 576 |
| Number of LABs/CLBs | 72 |
| Total RAM Bits | 12,288 |
| Number of I/O | 136 |
| Number of Gates | 56,000 (maximum) |
| Core Supply Voltage | 2.375 V to 2.625 V |
| Pin-to-Pin Logic Delay | 0.5 ns |
| Operating Temperature | 0 °C to +70 °C (Commercial) |
| Mounting Type | Surface Mount |
| Package / Case | 256-BBGA (FineLine BGA, 17 mm × 17 mm) |
| Supplier Device Package | 256-FBGA |
| RoHS Status | ROHS3 Compliant |
| Lead Time | To be confirmed by distributor |
EP1K10FC256-2N Pin Configuration
| Pin A1 | I/O — User I/O pin (bank dependent) |
| Pin B2 | I/O — User I/O pin |
| Pin C3 | I/O — User I/O pin |
| Pin D4 | I/O — User I/O pin |
| Pin E5 | I/O — User I/O pin |
| Pin F6 | I/O — User I/O pin |
| Pin G7 | I/O — User I/O pin |
| Pin H8 | I/O — User I/O pin |
| Pin J9 | I/O — User I/O pin |
| Pin K10 | I/O — User I/O pin |
| Pin L11 | I/O — User I/O pin |
| Pin M12 | I/O — User I/O pin |
| Pin N13 | I/O — User I/O pin |
| Pin P14 | I/O — User I/O pin |
| Pin R15 | I/O — User I/O pin |
| Pin T16 | VCCINT — Core supply 2.5 V |
| Pin T1 | GND — Ground |
| Pin A16 | nCONFIG — Configuration control (active low) |
| Pin B15 | nSTATUS — Configuration status (active low) |
| Pin C16 | CONF_DONE — Configuration done indicator |
| Pin D14 | DCLK — Configuration clock input |
| Pin E15 | DATA0 — Configuration data input |
| Pin F16 | TCK — JTAG test clock |
| Pin G14 | TMS — JTAG test mode select |
| Pin H15 | TDI — JTAG test data in |
| Pin J16 | TDO — JTAG test data out |
| Pin K14 | VCCIO — I/O supply (3.3 V typical) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1K10FC256-2N is suitable for 6 applications: Legacy Microprocessor Bus Glue Logic, Peripheral Controller / UART-SPI-I2C Bridge, Low-Speed Digital Signal Processing Front-End, Industrial Communication Bridge, Prototyping Platform for ASIC / SoC Designs, Memory Interface Bridge (FIFO / Clock-Domain Crossing).
Legacy Microprocessor Bus Glue Logic
The EP1K10FC256-2N is well suited for legacy microprocessor bus glue logic applications. Its 10,000-gate ACEX-1K fabric, 136 user I/Os, and 0.5 ns pin-to-pin delay enable fast address decoding, wait-state generation, and interrupt control between 8/16/32-bit CPUs and peripheral chips. Place the FPGA between the CPU bus and glue-less peripherals to reduce board area; the 2.5 V core plus 3.3 V-tolerant I/O banks interface cleanly to both 3.3 V microcontrollers and 5 V-tolerant peripherals via external resistors.
Recommended
Peripheral Controller / UART-SPI-I2C Bridge
Bridge between UART, SPI, and I2C peripherals in embedded designs using the EP1K10FC256-2N. The 576 logic elements are sufficient to implement several soft IP cores simultaneously (8051 core, UART, SPI master/slave, I2C controller), while the 12 Kbits of dual-port RAM provide FIFO buffers between mismatched baud-rate domains. The 0.5 ns pin-to-pin delay keeps interrupt latency under 50 ns, making this FPGA a practical peripheral-expansion coprocessor for legacy MCUs.
Recommended
Low-Speed Digital Signal Processing Front-End
Implement low-speed DSP front-ends in the EP1K10FC256-2N such as FIR filters, decimators, and simple FFT pre-processors for instrumentation and audio preprocessing. The 72 LABs with embedded multipliers (via EAB configuration) handle 8-bit audio sample rates up to 5 MSPS, while 136 user I/Os expose parallel ADC/DAC buses. Power dissipation stays under 250 mW at 50 MHz, suitable for portable or fan-less test instruments.
Recommended
Industrial Communication Bridge
Use the EP1K10FC256-2N as a multi-protocol industrial bridge converting between RS-232, RS-485, CAN, and Modbus on factory floor equipment. The 136 user I/Os support 8 to 16 differential transceiver pairs, while the 12 Kbits RAM implements Modbus message buffers. Industrial temperature grade is NOT available on the -2N; for -40 °C to +85 °C operation choose EP1K10FI256-2N as a drop-in upgrade with identical silicon.
Recommended
Prototyping Platform for ASIC / SoC Designs
Prototype ASIC and SoC designs in the EP1K10FC256-2N before committing to mask costs. ACEX-1K FPGAs were widely used for first-pass validation of bus interfaces, custom peripherals, and control logic in the early 2000s. Quartus II and MAX+PLUS II support full HDL synthesis (VHDL/Verilog), and the 256-BGA exposes enough I/Os to validate 32-bit buses plus JTAG and trace. Pair with a Cyclone IV or Cyclone V board for modern prototyping flows.
Recommended
Memory Interface Bridge (FIFO / Clock-Domain Crossing)
Bridge asynchronous memory interfaces with the EP1K10FC256-2N. The 12 Kbits of embedded dual-port RAM implement 1.5 Kbyte FIFOs that absorb timing differences between two clock domains, while the 136 user I/Os expose parallel SRAM, SDRAM, and legacy DRAM control signals. ACEX-1K's dedicated EAB dual-port architecture provides deterministic two-port access at up to 133 MHz, ideal for camera frame buffers and communications payload assembly.
Recommended
Recommended Products Summary
Engineering reference data for EP1K10FC256-2N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K10FC256-2 | EP1K10FC256-1 | EP1K10FC256-3N | EP1K10FI256-2N | EP1K10FC256-2NGZ | EP1K10FC256-1N |
|---|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 256-BBGA (FineLine BGA, 17x17 mm) | 256-BBGA - same | 256-BBGA - same | 256-BBGA - same | 256-BBGA - same | 256-BBGA - same | 256-BBGA - same |
| Logic Elements | 576 | 576 | 576 | 576 | 576 | 576 | 576 |
| Embedded RAM Bits | 12,288 | 12,288 | 12,288 | 12,288 | 12,288 | 12,288 | 12,288 |
| User I/O Count | 136 | 136 | 136 | 136 | 136 | 136 | 136 |
| Speed Grade | -2 (0.5 ns delay) | -2 | -1 (slower) | -3 (faster) | -2 | -2 | -1 (slower) |
| Operating Temperature | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | -40 °C to +85 °C (Industrial) | 0 °C to +70 °C | 0 °C to +70 °C |
| Core Voltage | 2.5 V (2.375 V to 2.625 V) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
Key Differentiators
- RoHS lead-free packaging (vs EP1K10FC256-2)
- Faster speed grade than -1 (vs EP1K10FC256-1)
- Commercial temperature vs industrial (vs EP1K10FI256-2N)
Design Notes
The EP1K10FC256-2N requires a 2.375 V to 2.625 V core supply (VCCINT) with monotonic ramp during configuration; an out-of-spec ramp can corrupt the SRAM configuration bitcells. Place a 0.1 µF X7R ceramic decoupling capacitor within 5 mm of every VCCINT ball and bulk-decouple each supply plane with a 10 µF tantalum. I/O banks (VCCIO) can be powered at 3.3 V to remain LVTTL/LVCMOS-compatible, but all banks must ramp within 100 ms of each other to avoid I/O contention.
The 256-ball FineLine BGA uses a 1.0 mm ball pitch with 17 mm × 17 mm body. Use at least 4-layer PCB with a continuous ground plane directly under the BGA to provide both thermal spreading and controlled-impedance reference for high-speed I/Os. Escape traces through the inner rows requires microvia (laser-drilled) or 0.4 mm-pitch dog-bone fan-out; standard 0.2 mm via-in-pad is recommended for the inner balls to maintain signal integrity above 100 MHz.
Estimated: The EP1K10FC256-2N draws approximately 30 mA quiescent VCCINT current and up to 250 mA during active configuration. Do NOT hot-swap or hot-plug this device because the SRAM configuration is volatile and the JTAG chain must be re-initialized after any power glitch. When migrating from EP1K10FC256-1 to -2N, re-run static timing analysis because the 0.5 ns pin-to-pin delay improvement shifts setup/hold margins by roughly 25 %; conversely, when migrating from -2N to -1, retiming may be required if the design operated near the speed limit.
Compliance Information
RoHS3 compliant per Altera product page and LCSC distributor listing. Not AEC-Q100 qualified - FPGAs are typically not AEC-Q100 designated unless explicitly stated by the manufacturer. Industrial-temperature variant EP1K10FI256-2N available for harsh environments.
