EP1K10FI256-2N vs EP1K10FC256-3N Comparison
Detailed side-by-side comparison of EP1K10FI256-2N by Intel and EP1K10FC256-3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP1K10FI256-2N | EP1K10FC256-3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last Time Buy | Obsolete |
| Family | ACEX 1K | ACEX-1K |
| Logic Elements (Cells) | 576 | — |
| Typical Gates | 10,000 | 10,000 |
| Embedded Array Blocks (EABs) | 3 (12,288 RAM bits) | — |
| Total RAM Bits | 12,288 | — |
| User I/O Count | 136 | — |
| Core Voltage | 2.5 V | 2.5 V |
| Process Technology | 0.22 µm CMOS | 0.22 µm CMOS |
| Speed Grade | -2 | -3 |
| Maximum Internal Frequency | 200 MHz | 200 MHz |
| Package | 256-Ball FBGA (FineLine BGA, 1.0 mm pitch) | 256-ball FBGA (17 mm × 17 mm) |
| Operating Temperature | -40 °C to +85 °C (Industrial) | Commercial (0 °C to +70 °C) |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG | — |
| Mounting Type | Surface Mount | Surface Mount |
| RoHS Status | [DATA_NEEDED: RoHS compliance status] | — |
| MSL Level | [DATA_NEEDED: moisture sensitivity level] | — |
| Logic Elements | — | 576 |
| LABs / CLBs | — | 72 |
| Embedded RAM Bits | — | 12,288 (12 Kbit) |
| User I/O Pins | — | 136 |
| Configuration Method | — | SRAM (volatile), external PROM or JTAG |
| Lead-Free / RoHS | — | Yes (N suffix) |