EP1K10FC256-3N - 10K Gates ACEX-1K FPGA, 256-FBGA | Intel / Altera
MPN: EP1K10FC256-3N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $38.2 | $382.00 |
| 100 | $33.75 | $3,375.00 |
| 500 | $28.9 | $14,450.00 |
| 1,000 | $24.5 | $24,500.00 |
Drop-in alternatives for EP1K10FC256-3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1K10FC256-3
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View Datasheet →EP1K10FC256-2N
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View Datasheet →EP1K10FC256-2
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View Datasheet →EP1K10FC256-1
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View Datasheet →EP1K100FC256-3N
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View Datasheet →EP1K10FC256-3N Maximum Ratings & Electrical Characteristics
| Family | ACEX-1K |
| Typical Gates | 10,000 |
| Logic Elements | 576 |
| LABs / CLBs | 72 |
| Embedded RAM Bits | 12,288 (12 Kbit) |
| User I/O Pins | 136 |
| Package | 256-ball FBGA (17 mm × 17 mm) |
| Core Voltage | 2.5 V |
| Process Technology | 0.22 µm CMOS |
| Maximum Internal Frequency | 200 MHz |
| Speed Grade | -3 |
| Configuration Method | SRAM (volatile), external PROM or JTAG |
| Operating Temperature | Commercial (0 °C to +70 °C) |
| Mounting Type | Surface Mount |
| Lead-Free / RoHS | Yes (N suffix) |
EP1K10FC256-3N 256-ball fbga (17 mm × 17 mm) Pin Configuration Guide
Complete pinout information for EP1K10FC256-3N (256-ball fbga (17 mm × 17 mm) package) with 136 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1K10FC256-3N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 136 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1K10FC256-3N is suitable for 6 applications: Legacy Industrial Glue-Logic Integration, Custom Interface Bridging (PCI / I2C / UART / SPI), Telecommunications Line-Card Pre-Processing, Test & Measurement Instrumentation Front-End, Aerospace & Defense Avionics Databus Interface, FPGA Education & Prototyping Platforms.
Legacy Industrial Glue-Logic Integration
The EP1K10FC256-3N replaces multiple 74-series TTL / CMOS glue-logic ICs by consolidating address decoding, bus arbitration, and interrupt steering into a single programmable device. With 576 logic elements and 12 Kbit embedded RAM, the part absorbs medium-complexity state machines while freeing board area. Its 136 user I/O pins connect directly to parallel industrial buses. Engineers keep ACEX-1K designs in production because the 2.5 V core and BGA footprint have been qualified for years in factory automation lines. Design tip: allocate roughly 30% logic utilization headroom for future ECOs.
Recommended
Custom Interface Bridging (PCI / I2C / UART / SPI)
The EP1K10FC256-3N is widely deployed as a protocol bridge between legacy microcontrollers and modern peripherals. Its 12 Kbit embedded RAM doubles as a small FIFO buffer for UART-to-SPI converters or I2C-to-parallel LCD controllers. The 200 MHz internal frequency supports 33 MHz PCI target interfaces, and the 136 I/O pins handle multiple bus segments simultaneously. Engineers favor ACEX-1K over CPLDs for this role because the embedded array blocks (EABs) implement true dual-port RAM without wasting logic cells.
Recommended
Telecommunications Line-Card Pre-Processing
ACEX-1K parts were a workhorse of late-1990s and early-2000s telecom line cards, and the EP1K10FC256-3N continues in service in legacy T1/E1 framers, HDLC controllers, and time-slot interchangers. The 256-FBGA package suits the high-density backplanes of central-office equipment, while the SRAM-based configuration lets carriers push field upgrades via JTAG. With 136 I/Os, the part aggregates low-speed serial channels before forwarding them to the main ASIC. Sustained production spares keep these cards running well beyond their nominal EOL.
Recommended
Test & Measurement Instrumentation Front-End
The EP1K10FC256-3N digitizes trigger logic, multiplexer control, and timing generators in mid-range oscilloscopes, logic analyzers, and protocol testers. Its 12 Kbit block RAM stores calibration coefficients, while 576 logic elements implement custom serial-decoding state machines for I2C, SPI, and CAN. Designers select ACEX-1K over newer Cyclone parts because the older 2.5 V core rail is already present in legacy instrument power trees. The 256-FBGA package requires only a 17 × 17 mm PCB footprint - small enough for handheld instruments.
Recommended
Aerospace & Defense Avionics Databus Interface
Long-life aerospace platforms maintain MIL-STD-1553, ARINC 429, and discrete I/O interfaces through EP1K10FC256-3N FPGAs. The commercial temperature grade is qualified into many non-flight-severe subassemblies, and the part's 15+ year production pedigree satisfies DO-254 design-assurance goals for legacy avionics refresh programs. The 12 Kbit block RAM implements message buffers for 1553 BC/RT/MT modes; 576 LEs handle Manchester encoding/decoding. Spares pooling is essential - aerospace buyers typically commit to 5-10 year inventory.
Recommended
FPGA Education & Prototyping Platforms
University digital-logic labs and maker communities still rely on ACEX-1K-based development boards because the MAX+PLUS II toolchain is freely available, runs on legacy Windows and Linux VMs, and exposes the full Quartus-style design flow. The EP1K10FC256-3N's 576 LEs are enough to teach VHDL/Verilog state-machine design, simple CPU cores, and bus-protocol exercises. The 256-FBGA package mirrors the high-density packages used in modern FPGAs, giving students realistic soldering and signal-integrity experience. Pre-owned Altera dev boards (e.g., UP1, Nios dev kit) populate the used-equipment market.
Recommended
Recommended Products Summary
Engineering reference data for EP1K10FC256-3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K10FC256-3 | EP1K10FC256-2N | EP1K10FC256-2 | EP1K10FC256-1 | EP1K100FC256-3N |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 256-FBGA (17×17 mm) | 256-FBGA (17×17 mm) - same | 256-FBGA (17×17 mm) - same | 256-FBGA (17×17 mm) - same | 256-FBGA (17×17 mm) - same | 256-FBGA (17×17 mm) - same |
| Speed Grade | -3 (fastest) | -3 | -2 | -2 | -1 | -3 |
| Lead-Free / N Suffix | Yes | No (SnPb) | Yes | No (SnPb) | No (SnPb) | Yes |
| Logic Elements | 576 | 576 | 576 | 576 | 576 | 4,992 |
| User I/O Pins | 136 | 136 | 136 | 136 | 136 | 136 (same I/O bank structure) |
| Embedded RAM Bits | 12,288 (12 Kbit) | 12,288 | 12,288 | 12,288 | 12,288 | 49,152 (4×) |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Lead-free RoHS-compliant finish with the fastest ACEX-1K speed grade (vs EP1K10FC256-3)
- Fastest -3 speed grade available in the ACEX-1K-10K family (vs EP1K10FC256-2N)
- Lowest-density ACEX-1K option, ideal for cost-sensitive glue-logic replacement (vs EP1K100FC256-3N)
Design Notes
The EP1K10FC256-3N requires a clean 2.5 V VCCINT rail and a separate VCCIO supply (typically 3.3 V or 2.5 V depending on I/O bank configuration). Place at least four 0.1 µF ceramic decoupling capacitors within 5 mm of the FBGA supply balls, plus one bulk 47-100 µF tantalum or polymer capacitor per supply rail within 25 mm. ACEX-1K VCCINT current scales with toggle rate and utilization - typical values are 150-400 mA at 100 MHz - so verify regulator current limit headroom above 1 A for thermal margin.
ACEX-1K is SRAM-based and volatile: the design bitstream is lost on every power-down. The most common first-time designer mistake is forgetting to include an external configuration PROM (EPC1, EPC2, or compatible third-party SPI flash) or JTAG download path. Without configuration, the FPGA powers up with all I/O pins in tri-state and no logic function. Verify the MSEL0/MSEL1 mode-select pins are correctly strapped for your chosen configuration scheme before board bring-up.
The 256-FBGA package uses a fine-pitch BGA with 1.0 mm ball pitch - PCB assembly requires precise solder-paste stencil aperture control (typically 0.45 mm diameter apertures on a 0.1-0.125 mm thick stainless-steel stencil). For prototype builds, use lead-free SAC305 solder paste and a reflow profile with 245 °C peak (for the "N" suffix) or 215-220 °C peak (SnPb EP1K10FC256-3 without "N"). X-ray inspection of all 256 balls after reflow is mandatory for high-reliability builds. Escape routing from the inner balls requires microvia or via-in-pad technology on a 4+ layer stack-up.
At 200 MHz internal operation, I/O switching rates on the EP1K10FC256-3N can reach 100-150 MHz on parallel buses. Match bus traces to within 10% of the target impedance (typically 50 Ω single-ended or 100 Ω differential for LVDS pairs), keep stubs short, and use 4-8 mil trace widths on the top microvia layer. Series-damping resistors (22-33 Ω) on each output pin reduce ground-bounce and SSN on heavily loaded buses. Maintain a continuous ground plane beneath the BGA footprint; avoid signal traces under the device body.
ACEX-1K FPGAs dissipate 0.5-2 W typical at moderate utilization, so thermal management is usually passive. However, in sealed enclosures at elevated ambient (e.g., industrial control cabinets at 60 °C+), the FBGA package benefits from a small thermal pad or copper flood under the exposed center balls connected to the inner ground ring. Estimated: at 1.5 W dissipation and a typical 0 JBGA theta-JA of 35-45 °C/W, junction temperature rises roughly 50-70 °C above ambient - keep ambient below 50 °C for reliable commercial-grade operation.
Compliance Information
RoHS compliant per N suffix; ACEX-1K family predates AEC-Q100 automotive qualification requirements and is not recommended for new automotive designs. REACH compliance inferred from RoHS statement. Halogen-free status not explicitly stated in available data.
