EP1K30FC256-2 vs EP1K30FC256-3NAA Comparison

Detailed side-by-side comparison of EP1K30FC256-2 by Intel and EP1K30FC256-3NAA by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP1K30FC256-2 EP1K30FC256-3NAA
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Family ACEX-1K ACEX-1K
Logic Elements 1,728 —
Typical Gates 30,000 —
Configurable Logic Blocks (CLBs) 216 —
On-chip RAM Bits 24,576 —
User I/O Pins 171 —
Speed Grade -2 -3 (ordering code)
Core Voltage 2.5 V —
Process Technology 0.22 µm CMOS —
Package 256-ball FineLine BGA (FBGA) —
Pin Count 256 —
Configuration Method SRAM (volatile, serial PROM or JTAG) —
JTAG Support Yes (IEEE 1149.1 boundary scan) —
Memory Type Dual-port EAB blocks —
Maximum Frequency 200 MHz —
Operating Temperature Grade Commercial —
Mounting Type Surface Mount (BGA) Surface Mount
RoHS Status [DATA_NEEDED: RoHS compliance status] —
Product Category — FPGA - Field Programmable Gate Array
Number of Logic Elements — 1728
Number of Gates — 30000 (30K)
Embedded RAM Bits — 24576 bits
Number of User I/Os — 171
Maximum Internal Clock Frequency — 200 MHz
Core Supply Voltage — 2.5 V
IC Process Technology — 0.22 um
Package Type — 256-ball FBGA (FineLine BGA)
Package Form — 256-BBGA
Configuration Type — SRAM-based, external configuration device required
Operating Temperature Range — [DATA_NEEDED: operating temperature range]
I/O Supply Voltage — [DATA_NEEDED: VCCIO voltage options]
Power Dissipation — [DATA_NEEDED: typical power dissipation, design dependent]
Lead-Free / RoHS — [DATA_NEEDED: manufacturer PCN confirms RoHS status]

Datasheets & Resources

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