EP1K30FC256-2 vs EP1K30FI256-2N Comparison

Detailed side-by-side comparison of EP1K30FC256-2 by Intel and EP1K30FI256-2N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP1K30FC256-2 EP1K30FI256-2N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Family ACEX-1K ACEX-1K
Logic Elements 1,728 —
Typical Gates 30,000 30,000
Configurable Logic Blocks (CLBs) 216 —
On-chip RAM Bits 24,576 —
User I/O Pins 171 —
Speed Grade -2 -2
Core Voltage 2.5 V —
Process Technology 0.22 µm CMOS 0.22 µm CMOS
Package 256-ball FineLine BGA (FBGA) 256-ball FineLine BGA (FBGA)
Pin Count 256 —
Configuration Method SRAM (volatile, serial PROM or JTAG) —
JTAG Support Yes (IEEE 1149.1 boundary scan) —
Memory Type Dual-port EAB blocks Dual-port Embedded Array Block (EAB)
Maximum Frequency 200 MHz —
Operating Temperature Grade Commercial Industrial
Mounting Type Surface Mount (BGA) Surface Mount
RoHS Status [DATA_NEEDED: RoHS compliance status] —
Logic Elements (LEs) — 1,728
Embedded RAM Bits — 24,576
Maximum User I/O — 171
Core Supply Voltage — 2.5 V
Maximum Internal Frequency — 200 MHz
Number of LABs — 216
Programmable via — JTAG (IEEE 1149.1)

Datasheets & Resources

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