EP1K30FI256-2N - 30K Gate ACEX-1K FPGA, 256-BGA | Intel / Altera
MPN: EP1K30FI256-2N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.75 | $2,875.00 |
| 500 | $22.1 | $11,050.00 |
| 1,000 | $18.4 | $18,400.00 |
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View Datasheet →EP1K30FI256-2N Maximum Ratings & Electrical Characteristics
| Family | ACEX-1K |
| Typical Gates | 30,000 |
| Logic Elements (LEs) | 1,728 |
| Embedded RAM Bits | 24,576 |
| Maximum User I/O | 171 |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V |
| Maximum Internal Frequency | 200 MHz |
| Number of LABs | 216 |
| Package | 256-ball FineLine BGA (FBGA) |
| Mounting Type | Surface Mount |
| Operating Temperature Grade | Industrial |
| Speed Grade | -2 |
| Programmable via | JTAG (IEEE 1149.1) |
| Memory Type | Dual-port Embedded Array Block (EAB) |
EP1K30FI256-2N 256-ball fineline bga (fbga) Pin Configuration Guide
Complete pinout information for EP1K30FI256-2N (256-ball fineline bga (fbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1K30FI256-2N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1K30FI256-2N is suitable for 7 applications: Industrial Glue Logic Replacement, ASIC Prototyping and Emulation, Interface Bridging and Protocol Conversion, Legacy Telecommunications Equipment Maintenance, Test and Measurement Instrumentation, Custom Peripheral Controllers, Educational FPGA Development Boards.
Industrial Glue Logic Replacement
The EP1K30FI256-2N's 1,728 logic elements and 171 user I/Os make it ideal for replacing multiple discrete logic ICs in industrial control boards. Its 2.5 V core operates reliably across -40 °C to +85 °C, and dual-port EABs (24,576 RAM bits) can replace small SRAM/DRAM glue chips. The 256-ball FineLine BGA package consolidates wide bus interfaces (16/32-bit data, 24-bit address) into a compact footprint, while 200 MHz internal operation supports moderate-rate state machines, custom peripherals, and proprietary bus protocols (e.g., legacy fieldbus, custom parallel camera links) without driving BOM cost.
Recommended
ASIC Prototyping and Emulation
Engineers use the EP1K30FI256-2N as an ASIC prototype for low-density custom silicon designs because its 30K gates and 24,576 RAM bits fit typical controller-class ASICs. Quartus II synthesis maps RTL to the ACEX-1K architecture, letting designers validate state machines and bus interfaces before committing to mask ROM. The 200 MHz internal frequency and JTAG-driven in-system programmability accelerate bring-up, while 171 user I/Os provide ample real-world signal access. This makes the EP1K30FI256-2N a stepping stone in design flows where Cyclone IV or Cyclone 10 LP would be the eventual migration target.
Recommended
Interface Bridging and Protocol Conversion
The EP1K30FI256-2N excels at bridging legacy parallel buses (ISA, VME, custom 16/32-bit interfaces) to modern serial standards, with 171 user I/Os accepting multiple LVTTL/LVCMOS banks concurrently. Designers can implement custom state machines and FIFOs in the dual-port EABs, mapping protocol stacks (UART, SPI, I2C, parallel video) without external glue logic. The 200 MHz internal clock rate is sufficient for typical 50-100 MHz bus bridging. The industrial temperature grade and 256-ball BGA footprint suit embedded industrial PC and test instrumentation applications where pin density matters.
Recommended
Legacy Telecommunications Equipment Maintenance
The EP1K30FI256-2N is used to maintain legacy telecom infrastructure where system lifetimes exceed 15 years. Its dual-port EAB RAM enables custom packet buffering and framing logic, while 171 user I/Os accommodate TDM bus interfaces and parallel control planes. The 2.5 V core and industrial temperature range meet NEBS-style reliability expectations. Service providers and telecom OEMs source the EP1K30FI256-2N through authorized remaining-stock and broker channels to support fielded systems, making lifecycle-aware design critical when planning long-term spares.
Recommended
Test and Measurement Instrumentation
The EP1K30FI256-2N is well-suited to custom digital test instruments that require parallel bus capture, custom triggering logic, and on-chip memory for sample buffering. The 1,728 LEs and 24,576 EAB bits let designers implement up to 32-channel logic analyzers, pattern generators, and protocol exercisers in a single device. The 171 user I/Os provide generous probe points for parallel digital buses, while the 256-ball BGA package supports compact instrument form factors. Quartus II toolchain and JTAG programming simplify factory calibration and firmware updates.
Recommended
Custom Peripheral Controllers
The EP1K30FI256-2N provides a flexible platform for building custom peripheral controllers (motor control, LED drivers, sensor aggregation) where off-the-shelf microcontrollers lack specific I/O combinations. Its 171 user I/Os support many simultaneous sensor channels, while dual-port EABs enable small buffer FIFOs for streaming data. The 200 MHz internal frequency accommodates DSP-style filter blocks at audio and low-rate control loop frequencies. Industrial temperature grading and the rugged BGA package suit factory-floor deployment, and JTAG-based in-system programming simplifies firmware updates.
Recommended
Educational FPGA Development Boards
The EP1K30FI256-2N is occasionally used in legacy educational FPGA development platforms because its 1,728 LEs and dual-port EABs offer ample resources for student lab exercises (counter design, UART implementation, VGA drivers). Its 256-ball BGA package and 171 user I/Os support breadboard-friendly breakout boards with banks of LEDs, switches, and 7-segment displays. The 200 MHz internal frequency is sufficient for typical teaching designs, and Quartus II Web Edition toolchain (legacy version) supports ACEX-1K targets. Note: new courses should adopt Cyclone IV or Cyclone 10 LP dev kits instead.
Recommended
Recommended Products Summary
Engineering reference data for EP1K30FI256-2N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K30FI256-2 | EP1K30FC256-2N | EP1K30FC256-3N | EP1K30FC256-3 | EP1K30F256-3 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-ball FineLine BGA | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same |
| Family | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K |
| Typical Gates | 30,000 | 30,000 | 30,000 | 30,000 | 30,000 | 30,000 |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 |
| RAM Bits | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 |
| Maximum User I/O | 171 | 171 | 171 | 171 | 171 | 171 |
| Speed Grade | -2 | -2 | -2 | -3 (faster) | -3 (faster) | -3 (faster) |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Operating Temperature | Industrial (-40 °C to +85 °C) | Industrial (-40 °C to +85 °C) | Industrial (-40 °C to +85 °C) | Industrial (-40 °C to +85 °C) | Commercial/Industrial | Industrial |
Key Differentiators
- Same-family -2 speed grade with industrial temperature rating in lead-free packaging (vs EP1K30FI256-2)
- Faster -3 speed grade option exists in same 256-ball FBGA footprint (vs EP1K30FC256-3N)
- Higher-density 100K-gate ACEX-1K option exists in same package (vs EP1K100FI256-2N)
Design Notes
The EP1K30FI256-2N requires a clean 2.5 V core supply capable of sourcing up to 300-500 mA during configuration and high-activity operation. Place 0.1 µF and 10 µF decoupling capacitors as close as possible to each VCCINT and VCCIO power ball pair, distributed across the BGA footprint. Power sequencing is not strictly required for ACEX-1K, but bringing up the 2.5 V rail before driving JTAG signals prevents in-system programming errors. Estimate: a heavily loaded 30K-gate design can draw 200-400 mA steady-state at 100 MHz internal clock.
The 256-ball FineLine BGA package has a 1.0 mm ball pitch, demanding 4-6 layer PCB stack-up with microvia or via-in-pad technology for reliable assembly. Use 0.5 oz copper outer layers and 1 oz inner power planes; route differential pairs and clocks on inner stripline layers with controlled impedance (50 Ω single-ended, 100 Ω differential). Estimate: a properly designed BGA breakout adds 8-12 mm to board area versus a QFP-256 footprint, so allocate BGA escape channels before finalizing schematic symbol.
Avoid driving JTAG signals (TDI, TDO, TMS, TCK) before the 2.5 V core supply has stabilized, which can cause configuration failure or non-volatile memory corruption in the device's configuration SRAM. Do not exceed the 2.5 V core voltage tolerance (±5%); over-voltage damages the 0.22 µm CMOS core. Verify that the Quartus II version supports ACEX-1K (legacy support through Quartus II 13.0sp1; newer Quartus Prime does NOT support ACEX-1K, requiring older toolchain installation).
ACEX-1K I/O buffers are unterminated; for high-speed buses (>50 MHz) or long traces (>50 mm), add source-series termination (22-33 Ω) at the FPGA output to dampen reflections. The 171 user I/Os are organized into four I/O banks, each with its own VCCIO rail supporting mixed voltage standards (LVTTL, LVCMOS, PCI). Do not mix 5 V PCI and 3.3 V LVTTL in the same bank. Estimate: a 32-bit DDR-style bus at 100 MHz on 75 mm traces requires 22 Ω source termination to keep overshoot below 0.5 V.
Compliance Information
EP1K30FI256-2N has the 'N' suffix indicating lead-free (Pb-free) packaging per Altera's legacy naming. AEC-Q100 is not applicable as this is an FPGA logic device, not an automotive-qualified analog/power part. REACH, halogen-free, and conflict minerals status not stated in available web data.