EP1K30FI256-2 vs EP1K30FI256-2N Comparison
Detailed side-by-side comparison of EP1K30FI256-2 by Intel and EP1K30FI256-2N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP1K30FI256-2 | EP1K30FI256-2N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Family | ACEX-1K | ACEX-1K |
| Logic Elements (LEs) | 1728 | 1,728 |
| Typical Gate Count | 30,000 gates | — |
| Embedded RAM Bits | 24,576 bits | 24,576 |
| Logic Array Blocks (LABs) | 216 | — |
| User I/O Pins | 171 | — |
| Maximum Internal Frequency | 200 MHz | 200 MHz |
| Process Technology | 0.22 µm CMOS | 0.22 µm CMOS |
| Core Supply Voltage (VCCINT) | 2.375 V to 2.625 V (2.5 V typical) | — |
| Package | 256-ball FBGA | 256-ball FineLine BGA (FBGA) |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40 °C to +85 °C (Industrial) | — |
| Speed Grade | -2 | -2 |
| Configuration Interface | JTAG / Serial / ByteBlaster | — |
| RoHS Status | [DATA_NEEDED: RoHS status not in verified web data] | — |
| Typical Gates | — | 30,000 |
| Maximum User I/O | — | 171 |
| Core Supply Voltage | — | 2.5 V |
| Number of LABs | — | 216 |
| Operating Temperature Grade | — | Industrial |
| Programmable via | — | JTAG (IEEE 1149.1) |
| Memory Type | — | Dual-port Embedded Array Block (EAB) |