EP1K30FI256-2 - 30K Gate ACEX-1K FPGA, 256-FBGA | Intel
MPN: EP1K30FI256-2 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $32.1 | $321.00 |
| 100 | $25.8 | $2,580.00 |
| 500 | $21.4 | $10,700.00 |
| 1,000 | $18.2 | $18,200.00 |
Drop-in alternatives for EP1K30FI256-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1K30FI256-2N
✅ Drop-In✓ In Stock
$18.4 / Unit
View Datasheet →EP1K10FI256-2
✅ Drop-In✓ In Stock
$10.4 / Unit
View Datasheet →EP1K30FC256-2
✅ Drop-In✓ In Stock
$22.95 / Unit
View Datasheet →EP1K30FC256-2N
✅ Drop-In✓ In Stock
$21.45 / Unit
View Datasheet →EP1K100FI256-2
✅ Drop-In✓ In Stock
$92 / Unit
View Datasheet →EP1K30FI256-2 Maximum Ratings & Electrical Characteristics
| Family | ACEX-1K |
| Logic Elements (LEs) | 1728 |
| Typical Gate Count | 30,000 gates |
| Embedded RAM Bits | 24,576 bits |
| Logic Array Blocks (LABs) | 216 |
| User I/O Pins | 171 |
| Maximum Internal Frequency | 200 MHz |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage (VCCINT) | 2.375 V to 2.625 V (2.5 V typical) |
| Package | 256-ball FBGA |
| Mounting Type | Surface Mount |
| Operating Temperature | -40 °C to +85 °C (Industrial) |
| Speed Grade | -2 |
| Configuration Interface | JTAG / Serial / ByteBlaster |
EP1K30FI256-2 256-ball fbga Pin Configuration Guide
Complete pinout information for EP1K30FI256-2 (256-ball fbga package) with 171 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1K30FI256-2.
Refer to the datasheet for full pin configuration.
Estimated pin count: 171 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1K30FI256-2 is suitable for 6 applications: PCI Bus Bridge and Interface Glue Logic, Industrial Control Logic and Motor Drive Interface, Telecom Backplane Glue Logic and Bus Bridging, ASIC Replacement for Low-Volume Production, Test and Measurement Front-End Logic, Legacy System Sustainment and Repair.
PCI Bus Bridge and Interface Glue Logic
The EP1K30FI256-2 fits PCI peripheral card glue-logic applications where its 1,728 logic elements are sufficient to implement a 32-bit PCI target interface plus custom peripheral logic. With 171 user I/Os and 2.5 V core, it can support a 5 V tolerant 33 MHz PCI bus using banked I/O. The device's 200 MHz fabric enables protocol bridging at full PCI bandwidth, while its JTAG port allows in-system ISP during card bring-up. Designers should budget roughly 600-900 LEs for a typical PCI target + DMA engine.
Recommended
Industrial Control Logic and Motor Drive Interface
The industrial -40 C to +85 C operating range of the EP1K30FI256-2 supports factory-floor and motor-drive interface applications such as encoder decoding, PWM generation, and fieldbus bridging. Its 24,576 bits of embedded RAM enable FIFO buffering for high-speed encoder streams, and the 171 I/Os accommodate multiple incremental encoder inputs plus drive enable outputs. The 2.5 V core and robust BGA package suit harsh-environment PCBs; engineers typically pair the FPGA with isolated gate drivers downstream.
Recommended
Telecom Backplane Glue Logic and Bus Bridging
Communication backplane applications requiring glue logic between standard buses (H.110, PCM, SPI, I2C, parallel data) can leverage the EP1K30FI256-2's generous 171 I/O count. The 200 MHz fabric enables protocol conversion at line rates exceeding 50 MHz, while the 24 Kbit embedded RAM provides elastic buffering for rate adaptation. The -2 speed grade is well-matched to telecom clock domains. Designers should verify timing closure for high-speed interfaces using Quartus II 9.1/11.1.
Recommended
ASIC Replacement for Low-Volume Production
The EP1K30FI256-2 suits low-volume ASIC replacements where non-recurring engineering (NRE) cost is prohibitive and time-to-market is critical. Its 30,000-gate capacity covers typical mid-complexity state machines, register files, and bus interfaces, while reprogrammability allows last-minute design changes. Engineers use the device for production volumes under 10K units annually, where mask charges would not amortize. Migration path: re-implement on Cyclone III EP3C5 or EP3C10 for new designs.
Recommended
Test and Measurement Front-End Logic
Test equipment front-end applications leverage the EP1K30FI256-2 for custom pattern generation, timing control, and measurement sequencing. The 200 MHz fabric supports high-speed trigger logic, and the 24 Kbit RAM enables waveform capture buffers. The 171 user I/Os accommodate numerous test points, while JTAG allows remote programming in ATE fixtures. The device pairs naturally with precision ADCs and DACs on the same board for closed-loop stimulus/response systems.
Recommended
Legacy System Sustainment and Repair
Long-lifecycle industrial and military programs require continued supply of the EP1K30FI256-2 to repair and sustain fielded equipment. The 256-FBGA package, 2.5 V core, and known-good ACEX-1K architecture are preserved for direct form-fit-function drop-in repairs. Sustainment engineering typically procures through authorized brokers and verified secondary-market channels with date-code and traceability documentation. Modern migration requires full board redesign toward Cyclone III/IV equivalents.
Recommended
Recommended Products Summary
Engineering reference data for EP1K30FI256-2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K30FI256-2N | EP1K10FI256-2 | EP1K30FC256-2 | EP1K30FC256-2N | EP1K100FI256-2 |
|---|---|---|---|---|---|---|
| Package | 256-ball FBGA (FI256) | 256-ball FBGA (FI256) | 256-ball FBGA (FI256) | 256-ball FBGA (FC256) | 256-ball FBGA (FC256) | 256-ball FBGA (FI256) |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 1728 | 1728 | 576 | 1728 | 1728 | 4992 |
| Typical Gates | 30,000 | 30,000 | 10,000 | 30,000 | 30,000 | 100,000 |
| User I/O Count | 171 | 171 | 136 | 171 | 171 | 171 |
| Embedded RAM Bits | 24,576 | 24,576 | 12,288 | 24,576 | 24,576 | 49,152 |
| Speed Grade | -2 | -2 | -2 | -2 | -2 | -2 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | 0 C to +70 C (Commercial) | 0 C to +70 C (Commercial) | -40 C to +85 C (Industrial) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Pin-compatible industrial-temperature Pb-free variant (vs EP1K30FI256-2N)
- Higher logic density in same 256-FBGA package (vs EP1K100FI256-2)
- Higher pin count than smaller ACEX-1K die (vs EP1K10FI256-2)
Design Notes
The EP1K30FI256-2 requires a tightly regulated 2.5 V core supply within the 2.375 V to 2.625 V tolerance band per the ACEX-1K datasheet. Use an LDO with adequate headroom from a 3.3 V rail, or a DC-DC converter followed by an LDO post-regulator. Power sequencing requires VCCINT to come up before VCCIO banks; failure to sequence may cause latch-up or permanent damage. Decoupling: place 0.1 uF X7R ceramics adjacent to every VCCINT ball, plus a 10 uF bulk capacitor near the device. Estimated: at 200 MHz toggle activity, dynamic current can exceed 200 mA; size rails accordingly.
The 256-ball FBGA requires microvia or laser-drilled via technology on 4-layer PCBs. Plan BGA fanout with 0.8 mm pitch escape routing, using via-in-pad only if the assembly house supports it. Keep at least 2 signal layers free in the BGA field for breakout. The exposed center balls of the FI256 package may be No-Connects or thermal pads; verify with the package mechanical drawing before completing layout. Controlled-impedance routing (50 ohm single-ended, 100 ohm differential) is required for any I/O running above 50 MHz.
Configuration device selection: pair the EP1K30FI256-2 with an EPC2-series configuration PROM for production programming; do not rely on JTAG-only in manufacturing. Quartus software: the ACEX-1K family is supported only through Quartus II 13.0sp1 - earlier releases may have better device support; Quartus Prime does not include ACEX-1K. Obsolescence: source through authorized brokers with date-code verification; expect pricing premium of 3-10x versus original. JTAG chain: confirm TCK frequency matches the slowest device if multiple JTAG devices share the chain.
Estimated: at 200 MHz internal frequency, edge rates of 1-2 ns on LVTTL outputs can produce significant overshoot on improperly terminated traces. Add 22-33 ohm series damping resistors at the FPGA output for high-speed clocks and SDRAM interfaces. Use differential pairs for clocks routed more than 5 cm on FR-4. Place reference planes unbroken beneath high-speed traces; avoid routing across plane splits which cause return-path discontinuities.
Estimated: at full 200 MHz utilization across 171 I/Os switching simultaneously, junction-to-ambient thermal resistance (theta_JA) for the 256-FBGA on a 4-layer JEDEC test board is approximately 20-25 C/W. At an ambient of +85 C with 1 W dissipation, junction temperature reaches 105-110 C - within industrial limits but with minimal margin. For continuous high-activity designs in high-ambient environments, consider airflow or attach a heatsink over the BGA top side.
Compliance Information
RoHS status not provided in verified web data; the EP1K30FI256-2N variant suffix 'N' typically indicates Pb-free finish on Intel/Altera legacy FPGAs. For new designs requiring RoHS, prefer the EP1K30FI256-2N explicitly.
