EP1K30FI256-2 vs EP1K50FI256-2 Comparison
Detailed side-by-side comparison of EP1K30FI256-2 by Intel and EP1K50FI256-2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP1K30FI256-2 | EP1K50FI256-2 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Family | ACEX-1K | ACEX 1K |
| Logic Elements (LEs) | 1728 | — |
| Typical Gate Count | 30,000 gates | — |
| Embedded RAM Bits | 24,576 bits | — |
| Logic Array Blocks (LABs) | 216 | 360 |
| User I/O Pins | 171 | 186 |
| Maximum Internal Frequency | 200 MHz | 200 MHz |
| Process Technology | 0.22 µm CMOS | 0.22 µm |
| Core Supply Voltage (VCCINT) | 2.375 V to 2.625 V (2.5 V typical) | — |
| Package | 256-ball FBGA | 256-ball FBGA |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40 °C to +85 °C (Industrial) | — |
| Speed Grade | -2 | — |
| Configuration Interface | JTAG / Serial / ByteBlaster | — |
| RoHS Status | [DATA_NEEDED: RoHS status not in verified web data] | Non-compliant (legacy product) |
| Series | — | ACEX-1K |
| Logic Elements / Cells | — | 2,880 |
| Total Gates (typical) | — | 50,000 |
| Embedded Array Blocks (EABs) | — | 12 |
| Total RAM Bits | — | 40,960 |
| Number of I/O Banks | — | 4 |
| Core Voltage | — | 2.5 V |
| Operating Temperature Grade | — | Industrial |
| Configuration Method | — | SRAM (volatile, serial/PROM/JTAG) |
| Lead-Free | — | No |