EP1K30FI256-2 vs EP1K50FI256-2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1K30FI256-2 sa pamamagitan ng Intel at EP1K50FI256-2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1K30FI256-2 | EP1K50FI256-2 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | ACEX-1K | ACEX 1K |
| Logic Elements (LEs) | 1728 | — |
| Typical Gate Count | 30,000 gates | — |
| Embedded RAM Bits | 24,576 bits | — |
| Logic Array Blocks (LABs) | 216 | 360 |
| User I/O Pins | 171 | 186 |
| Maximum Internal Frequency | 200 MHz | 200 MHz |
| Process Technology | 0.22 µm CMOS | 0.22 µm |
| Core Supply Voltage (VCCINT) | 2.375 V to 2.625 V (2.5 V typical) | — |
| Packhaging | 256-ball FBGA | 256-ball FBGA |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | -40 °C to +85 °C (Industrial) | — |
| Speed Grade | -2 | — |
| Configuration Interface | JTAG / Serial / ByteBlaster | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status not in verified web data] | Non-compliant (legacy product) |
| Series | — | ACEX-1K |
| Logic Elements / Cells | — | 2,880 |
| Total Gates (typical) | — | 50,000 |
| Embedded Array Blocks (EABs) | — | 12 |
| Total RAM Bits | — | 40,960 |
| Number of I/O Banks | — | 4 |
| Core Voltage | — | 2.5 V |
| Operating Temperature Grade | — | Industrial |
| Configuration Method | — | SRAM (volatile, serial/PROM/JTAG) |
| Lead-Free | — | No |