EP1K30FI256-2N vs EP1K30FC256-2 Comparison

Detailed side-by-side comparison of EP1K30FI256-2N by Intel and EP1K30FC256-2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP1K30FI256-2N EP1K30FC256-2
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Family ACEX-1K ACEX-1K
Typical Gates 30,000 30,000
Logic Elements (LEs) 1,728 —
Embedded RAM Bits 24,576 —
Maximum User I/O 171 —
Process Technology 0.22 µm CMOS 0.22 µm CMOS
Core Supply Voltage 2.5 V —
Maximum Internal Frequency 200 MHz —
Number of LABs 216 —
Package 256-ball FineLine BGA (FBGA) 256-ball FineLine BGA (FBGA)
Mounting Type Surface Mount Surface Mount (BGA)
Operating Temperature Grade Industrial Commercial
Speed Grade -2 -2
Programmable via JTAG (IEEE 1149.1) —
Memory Type Dual-port Embedded Array Block (EAB) Dual-port EAB blocks
Logic Elements — 1,728
Configurable Logic Blocks (CLBs) — 216
On-chip RAM Bits — 24,576
User I/O Pins — 171
Core Voltage — 2.5 V
Pin Count — 256
Configuration Method — SRAM (volatile, serial PROM or JTAG)
JTAG Support — Yes (IEEE 1149.1 boundary scan)
Maximum Frequency — 200 MHz
RoHS Status — [DATA_NEEDED: RoHS compliance status]

Datasheets & Resources

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