EP1K50FC256-3 vs EP1K50FC256-2N Comparison
Detailed side-by-side comparison of EP1K50FC256-3 by Intel and EP1K50FC256-2N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP1K50FC256-3 | EP1K50FC256-2N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last Time Buy | Obsolete |
| Series | ACEX-1K | — |
| Family | ACEX 1K | ACEX-1K |
| Logic Elements (LEs) | 2,880 | 2,880 |
| Typical Gates | 50,000 | 50,000 |
| Embedded RAM Bits | 40,960 | — |
| Logic Array Blocks (LABs) | 360 | 360 |
| Embedded Array Blocks (EABs) | 12 | 10 |
| Maximum User I/O | 186 | — |
| Core Voltage | 2.5 V | — |
| Process Technology | 0.22 um CMOS | 0.22 µm CMOS SRAM |
| Maximum Frequency | 166.67 MHz | — |
| Speed Grade | -3 | -2 |
| Package | 256-pin FineLine BGA (FBGA-256) | 256-ball FBGA (FineLine BGA) |
| Package Dimensions | 17 x 17 mm | 16 x 16 mm |
| Operating Temperature | Commercial (0C to +70C) [DATA_NEEDED: exact operating temp grade] | 0 °C to 70 °C (Commercial) |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Programming Interface | JTAG (IEEE 1149.1), ByteBlaster | — |
| Embedded Memory (bits) | — | 40,960 |
| Maximum User I/O Pins | — | 186 |
| Core Voltage (VCCINT) | — | 2.5 V (2.375 V to 2.625 V) |
| Configuration Method | — | JTAG / Passive Serial |
| RoHS Status | — | [DATA_NEEDED: RoHS status] |