EP1K50FC256-3 - 50K-Gate ACEX-1K FPGA, 256-BGA | Intel / Altera
MPN: EP1K50FC256-3 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $85 | $85.00 |
| 10 | $76.5 | $765.00 |
| 100 | $68 | $6,800.00 |
| 500 | $61.2 | $30,600.00 |
| 1,000 | $54.4 | $54,400.00 |
Drop-in alternatives for EP1K50FC256-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1K50FC256-3N
✅ Drop-In✓ In Stock
$84 / Unit
View Datasheet →EP1K50FC256-2
✅ Drop-In✓ In Stock
$62 / Unit
View Datasheet →EP1K50FC256-1
✅ Drop-In✓ In Stock
$18.95 / Unit
View Datasheet →EP1K50FC256-2N
✅ Drop-In✓ In Stock
$17.95 / Unit
View Datasheet →EP1K50FC256-1N
✅ Drop-In✓ In Stock
$15.1 / Unit
View Datasheet →EP1K50FI256-2N
✅ Drop-In✓ In Stock
$23.9 / Unit
View Datasheet →EP1K50FC256-3 Maximum Ratings & Electrical Characteristics
| Series | ACEX-1K |
| Family | ACEX 1K |
| Logic Elements (LEs) | 2,880 |
| Typical Gates | 50,000 |
| Embedded RAM Bits | 40,960 |
| Logic Array Blocks (LABs) | 360 |
| Embedded Array Blocks (EABs) | 12 |
| Maximum User I/O | 186 |
| Core Voltage | 2.5 V |
| Process Technology | 0.22 um CMOS |
| Maximum Frequency | 166.67 MHz |
| Speed Grade | -3 |
| Package | 256-pin FineLine BGA (FBGA-256) |
| Package Dimensions | 17 x 17 mm |
| Mounting Type | Surface Mount |
| Programming Interface | JTAG (IEEE 1149.1), ByteBlaster |
EP1K50FC256-3 17 x 17 mm Pin Configuration Guide
Complete pinout information for EP1K50FC256-3 (17 x 17 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1K50FC256-3.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1K50FC256-3 is suitable for 6 applications: Telecom Interface and Glue Logic, Industrial Control and Automation, PCI Bus Interface Controller, Digital Signal Processing Front-End, Reconfigurable Computing Platform, Legacy Equipment Maintenance and Repair.
Telecom Interface and Glue Logic
The EP1K50FC256-3 fits telecom interface and glue logic consolidation tasks because its 2,880 logic elements and 186 user I/O pins provide ample capacity to bridge between ASICs, microprocessors, and physical-layer devices. The 12 embedded EABs of 4 Kbits each deliver 40,960 bits of dual-port RAM for buffering packet data, while the 2.5 V core and multi-voltage I/O banks enable direct interfacing with legacy 5 V and modern 3.3 V telecom chipsets. Designers typically use the device to implement custom TDM bus converters, framer/chip interfaces, and line-card control logic, replacing dozens of discrete PAL/GAL devices with a single reprogrammable part. The 166.67 MHz performance on the -3 speed grade comfortably handles E1/T1 and lower-rate telecom interfaces.
Recommended
Industrial Control and Automation
Industrial control and automation systems benefit from the EP1K50FC256-3's high I/O count, flexible voltage support, and on-chip memory for state machines and data logging. The 186 user I/O can directly drive dozens of opto-isolated inputs, relay outputs, encoder channels, and HMI displays without external bus expanders, while 12 dual-port EABs handle FIFO buffering between asynchronous industrial networks such as RS-485, Modbus, and proprietary fieldbuses. The 2.5 V core plus 3.3 V/5 V-tolerant I/O banks allow direct connection to legacy 5 V sensors and actuators. For harsh industrial environments, the industrial-temperature EP1K50FI256-2N variant is recommended as a drop-in replacement.
Recommended
PCI Bus Interface Controller
The EP1K50FC256-3 was a popular choice for PCI bus interface controllers in legacy PC and embedded systems because its 50K-gate density, 186 user I/O, and 166.67 MHz internal performance comfortably implement the 32-bit/33 MHz PCI specification. The 12 EABs provide dual-port FIFO buffering for transaction data, while the 5 V-tolerant I/O banks interface directly with the PCI bus signal levels. Engineers typically used the device to implement custom add-in cards, embedded controllers, and IP-block bridges in industrial PCs. New designs targeting modern PCIe should migrate to Cyclone IV or Cyclone V with PCIe hard IP blocks rather than emulating PCI in soft logic.
Recommended
Digital Signal Processing Front-End
DSP front-end designs leverage the EP1K50FC256-3's combination of 2,880 logic elements, dual-port EAB RAM, and high I/O bandwidth for pre-processing data before handoff to a dedicated DSP processor. Typical applications include custom FIR/IIR filter banks, FFT pre-processing stages, and digital down/up-converters for software-defined radio. The 40,960 bits of embedded RAM provide coefficient storage and delay-line buffering, while the 186 user I/O connect to high-speed ADCs and DACs. The -3 speed grade's 166.67 MHz performance enables real-time processing of moderate-bandwidth signals. Modern alternatives with dedicated hardware multipliers would deliver higher DSP throughput but require PCB redesign.
Recommended
Reconfigurable Computing Platform
The EP1K50FC256-3 serves as the reconfigurable fabric in custom computing platforms where the FPGA implements algorithm-specific hardware accelerators alongside a host processor. Its 2,880 LEs and 40,960 RAM bits provide enough resources for cryptographic accelerators, image processing kernels, or network protocol offload engines, while the JTAG interface and Altera configuration scheme support in-system reconfiguration for multi-mode operation. The 256-ball BGA package supports high-speed signal integrity for parallel processor buses. For new designs, Cyclone V SoC integrates a hard ARM core alongside the FPGA fabric, eliminating the need for an external host processor in many applications.
Recommended
Legacy Equipment Maintenance and Repair
Maintenance and repair of legacy equipment originally designed around the EP1K50FC256-3 is the most common current application for this part, given its last-time-buy lifecycle status as of 2026-09-07. Industrial, medical, and aerospace systems with 15-25 year service lives require exact-form-factor FPGAs for field replacements, and the 256-ball FineLine BGA footprint of the EP1K50FC256-3 is shared with multiple ACEX-1K family variants for inventory flexibility. Engineers sourcing replacement parts should verify exact speed grade, temperature grade, and lead-free status against the original BOM, and may need to consider programmed-part recovery services if factory-new stock is exhausted.
Recommended
Recommended Products Summary
Engineering reference data for EP1K50FC256-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K50FC256-3N | EP1K50FC256-2 | EP1K50FC256-1 | EP1K50FC256-2N | EP1K50FI256-2N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-FBGA | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same |
| Speed Grade | -3 (166.67 MHz) | -3 (166.67 MHz) | -2 (~133 MHz) | -1 (~100 MHz) | -2 (~133 MHz) | -2 (~133 MHz) |
| Logic Elements | 2,880 | 2,880 | 2,880 | 2,880 | 2,880 | 2,880 |
| Embedded RAM Bits | 40,960 | 40,960 | 40,960 | 40,960 | 40,960 | 40,960 |
| Maximum User I/O | 186 | 186 | 186 | 186 | 186 | 186 |
| Temperature Grade | Commercial [DATA_NEEDED] | Commercial | Commercial | Commercial | Commercial | Industrial (-40C to +100C) |
| Lead-Free | [DATA_NEEDED] | Yes (N suffix) | No | No | Yes (N suffix) | Yes (N suffix) |
Key Differentiators
- Fastest -3 speed grade in the ACEX-1K 50K family (vs EP1K50FC256-2)
- Lead-free reflow compliance with identical silicon (vs EP1K50FC256-3 (non-N))
- Industrial temperature grade drop-in option (vs EP1K50FI256-2N)
Design Notes
Estimated: The 256-ball FineLine BGA uses a 1.0 mm ball pitch, which is compatible with mainstream SMT assembly but requires careful PCB pad design (non-solder-mask-defined pads recommended) and precise reflow profile control. Use a 4-zone or 6-zone reflow oven with nitrogen atmosphere for best void control. X-ray inspection is mandatory for post-reflow BGA quality verification; optical inspection alone cannot detect head-in-pillow defects or BGA shorts under the package.
Estimated: The EP1K50FC256-3 requires a clean 2.5 V core supply with at least 10% headroom and bulk decoupling of 100 uF tantalum plus 0.1 uF ceramic per VCC pin. The multi-voltage I/O banks each require their own VCCIO supply (2.5 V, 3.3 V, or 5 V) and must be decoupled independently. Use a star-ground topology with separate analog and digital ground planes connected at a single point near the FPGA to minimize switching noise coupling into configuration logic.
Do not confuse the EP1K50FC256-3 (ACEX-1K family) with EP1K50QC208 (208-pin PQFP package) or EP1K50FI484 (484-pin FBGA) - same silicon but different footprints are NOT drop-in compatible. Also note that ACEX-1K configuration bitstreams are NOT compatible with Cyclone series devices; Quartus II will not allow bitstream conversion between these families. Plan for last-time-buy inventory if your design requires long-term field support beyond 2027-2028.
The 256-ball FBGA package requires thermal management for sustained high-utilization designs; thermal resistance theta-JA is approximately 18 C/W with a standard 4-layer JEDEC test board, but rises to 30+ C/W in poorly ventilated enclosures. Use thermal vias under the package center and copper pours on inner layers to spread heat. Monitor junction temperature during prototype characterization using the on-chip temperature-sensing diode (if available in your silicon revision) or external thermal couple.
Compliance Information
RoHS, REACH, and lead-free status not confirmed in verified web data; use [DATA_NEEDED] markers in specs[] for traceability. Industrial-grade variants (EP1K50FI256-2N) are not AEC-Q100 qualified - automotive applications require different device families.
