EP1K50FC484-2N vs EP1K50FI484-2N Comparison

Detailed side-by-side comparison of EP1K50FC484-2N by Intel and EP1K50FI484-2N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP1K50FC484-2N EP1K50FI484-2N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Family ACEX 1K ACEX 1K
Logic Elements / Cells 2,880 —
Total Gates 50,000 —
Logic Array Blocks (LABs) 360 —
Embedded Memory (bits) 40,960 —
Number of User I/O 249 —
Core Voltage 2.5 V —
Process Technology 0.22 µm 0.22 µm CMOS
Speed Grade -2 -2
Operating Temperature Grade Commercial —
Maximum Operating Frequency 200 MHz 200 MHz
Package 484-ball FBGA (FineLine BGA) 484-pin FBGA (FineLine BGA)
Mounting Type Surface Mount (BGA) Surface Mount
Programmability SRAM-based, in-system via JTAG —
I/O Standards Supported LVTTL, LVCMOS, PCI (per family datasheet) —
Memory Type Dual-port embedded array blocks (EABs) —
RoHS Status [DATA_NEEDED: RoHS status for -2N suffix] [DATA_NEEDED: RoHS compliance status]
Typical Gates — 50,000
Logic Elements — 2,880
Core Voltage (VCCINT) — 2.5 V
I/O Voltage (VCCIO) — 2.5 V / 3.3 V (MultiVolt)
Embedded Memory (EAB) — 40,960 bits
User I/O Pins (max) — 333
Operating Temperature — -40 °C to +85 °C (industrial)
Programming Interface — JTAG (IEEE 1149.1) / ByteBlaster
Total Logic Elements (LE) — 2,880

Datasheets & Resources

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