EP1K50FC484-2N - 50K-Gate ACEX 1K FPGA, 249 I/O, 484-BGA | Intel
MPN: EP1K50FC484-2N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $48.5 | $48.50 |
| 10 | $42 | $420.00 |
| 100 | $35.2 | $3,520.00 |
| 500 | $29.8 | $14,900.00 |
| 1,000 | $26.4 | $26,400.00 |
Drop-in alternatives for EP1K50FC484-2N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1K50FC484-2
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View Datasheet →EP1K50FC484-1N
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View Datasheet →EP1K50FC484-1
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View Datasheet →EP1K100FC484-2N
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View Datasheet →EP1K100FC484-2
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View Datasheet →EP1K100FI484-2N
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View Datasheet →EP1K50FC484-2N Maximum Ratings & Electrical Characteristics
| Family | ACEX 1K |
| Logic Elements / Cells | 2,880 |
| Total Gates | 50,000 |
| Logic Array Blocks (LABs) | 360 |
| Embedded Memory (bits) | 40,960 |
| Number of User I/O | 249 |
| Core Voltage | 2.5 V |
| Process Technology | 0.22 µm |
| Speed Grade | -2 |
| Operating Temperature Grade | Commercial |
| Maximum Operating Frequency | 200 MHz |
| Package | 484-ball FBGA (FineLine BGA) |
| Mounting Type | Surface Mount (BGA) |
| Programmability | SRAM-based, in-system via JTAG |
| I/O Standards Supported | LVTTL, LVCMOS, PCI (per family datasheet) |
| Memory Type | Dual-port embedded array blocks (EABs) |
EP1K50FC484-2N 484-ball fbga (fineline bga) Pin Configuration Guide
Complete pinout information for EP1K50FC484-2N (484-ball fbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1K50FC484-2N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1K50FC484-2N is suitable for 6 applications: Telecom Line-Card Glue Logic, Industrial Control Board I/O Bridging, Display Controller / Timing Generator, Custom Peripheral Interface for Embedded CPUs, ASIC Prototyping, Legacy Board Repair and Sustainment.
Telecom Line-Card Glue Logic
The EP1K50FC484-2N fits telecom line-card glue logic because its 50K-gate capacity and 249 I/O pins comfortably bridge legacy TDM buses (T1/E1, H.110) to modern framers and network processors. The device's dual-port embedded RAM (40,960 bits) implements elastic stores, jitter attenuators, and small protocol-state FIFOs without external memory. Per the ACEX 1K family datasheet, the 2.5 V core with 5 V-tolerant I/O banks allows direct interface to legacy 5 V logic on backplane interfaces without level shifters. At 200 MHz internal frequency with speed grade -2, the device easily meets typical 8-66 MHz telecom bus timing requirements while leaving timing margin for protocol conversion. Engineers historically deployed EP1K50FC484-2N at the line-interface side of Class-5 switches and DLC equipment where a moderate-density, low-cost, 5 V-tolerant programmable device outperforms CPLDs.
Recommended
Industrial Control Board I/O Bridging
The EP1K50FC484-2N suits industrial control boards as a programmable I/O bridge between MCUs (often 3.3 V CMOS) and legacy 5 V industrial peripherals (relay drivers, opto-isolated inputs, 24 V-tolerant buffers). With 249 I/O pins, a single device can manage an entire front-panel or backplane interface including keypad scan, LCD control, RS-232/422/485 multiplexing, and discrete I/O expansion. The ACEX 1K 2.5 V core with banked I/O supports mixed-voltage design (one bank at 3.3 V to MCU, another at 5 V to legacy). Per the family datasheet, in-system JTAG programmability allows field firmware updates without removing the control board from the chassis — important for installed industrial systems. SRAM-based programmability requires a configuration EEPROM (typically EPC2 or EPC4) for cold-start; this is the main design consideration vs non-volatile FPGAs.
Recommended
Display Controller / Timing Generator
The EP1K50FC484-2N is well-matched to LCD and CRT timing controller roles where 50K gates and 249 I/O handle pixel-clock generation, sync processing, color-space conversion, and OSD overlay. The device's 200 MHz internal frequency supports pixel clocks up to ~80 MHz when using 2x oversampling, covering XGA (60 Hz) and SXGA-resolution panels. Dual-port embedded RAM is ideal for frame-buffer line storage and pixel-rate lookup tables (gamma correction). Per the ACEX 1K family datasheet, PCI-compliant I/O banks allow direct connection to PCI graphics cards or video-capture ASICs. Designers typically pair the FPGA with an external SDRAM for full frame buffering; the EP1K50FC484-2N manages timing and color pipeline while SDRAM stores pixel data.
Recommended
Custom Peripheral Interface for Embedded CPUs
The EP1K50FC484-2N is frequently deployed as a peripheral expander for embedded microprocessors and DSPs that lack specific bus interfaces. With 249 I/O, the FPGA can implement multiple interfaces simultaneously — e.g., a single device bridges an EMIF to a Camera Link, an SPI bus to a NAND flash controller, and a parallel port to an FPGA mezzanine card (FMC). The 50K-gate fabric comfortably handles 8-bit microcontroller cores (NIOS or custom), bus arbiters, DMA controllers, and protocol encoders in one device. Per ACEX 1K family documentation, the JTAG-based in-system programmability simplifies firmware updates in production and field. Designers benefit from the ability to add/modify peripherals late in the product cycle without respinning the host CPU board.
Recommended
ASIC Prototyping
The EP1K50FC484-2N served as a workhorse ASIC prototyping vehicle in the early-2000s design community, providing 50K-gate capacity sufficient to model ASIC blocks at 5-10× RTL gate-equivalent density. The 249 I/O and 484-ball FBGA expose most internal signals to logic-analyzer or scope probing for validation. Per ACEX 1K family documentation, the Quartus II toolchain supports incremental compilation and partition-based synthesis workflows useful for multi-engineer prototyping teams. Engineers can debug logic in-system at near-ASIC clock speeds (limited to ~200 MHz vs typical ASICs at 300-500 MHz), then port validated RTL to a foundry ASIC. The trade-off: SRAM-based configuration requires external boot EEPROM and is volatile — a consideration for prototype reliability testing.
Recommended
Legacy Board Repair and Sustainment
The EP1K50FC484-2N remains in active demand for sustaining legacy telecom, industrial, and military equipment originally designed with ACEX 1K FPGAs in the 2000-2010 timeframe. End-customers in defense, railway signaling, and power-grid control cannot easily redesign boards rated for 20-30 year service lives, so replacement EP1K50FC484-2N devices must be sourced to repair fielded systems. The 484-ball FBGA requires BGA rework stations for installation, but the footprint matches existing board layouts. Per ACEX 1K family documentation, identical pinout across speed grades and N/non-N finish variants allows flexibility in matching original bill-of-material. Lead time is 2-4 weeks via distributor stock, and franchised brokers (Rochester Electronics, Lantek) sometimes hold bonded inventory.
Recommended
Recommended Products Summary
Engineering reference data for EP1K50FC484-2N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K50FC484-2 | EP1K50FC484-1N | EP1K50FC484-1 | EP1K100FC484-2N |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 484-ball FBGA | 484-ball FBGA — same | 484-ball FBGA — same | 484-ball FBGA — same | 484-ball FBGA — same |
| Family | ACEX 1K | ACEX 1K | ACEX 1K | ACEX 1K | ACEX 1K |
| Total System Gates | 50,000 | 50,000 — same | 50,000 — same | 50,000 — same | 100,000 (+100%) |
| Logic Elements / Cells | 2,880 | 2,880 — same | 2,880 — same | 2,880 — same | 4,992 (+73%) |
| Speed Grade | -2 | -2 — same | -1 (slower) | -1 (slower) | -2 — same |
| Ball Finish | Lead-free (N suffix) | Lead-based (no N) | Lead-free | Lead-based | Lead-free |
| Number of User I/O | 249 | 249 — same | 249 — same | 249 — same | 333 (+34%) |
| Embedded Memory (bits) | 40,960 | 40,960 — same | 40,960 — same | 40,960 — same | 49,920 (+22%) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Higher gate density than EP1K30FC256-2N in same 484-ball FBGA-class family (vs EP1K30FC256-2N)
- Smaller BGA package and 84 fewer I/O than EP1K100FC484-2N (vs EP1K100FC484-2N)
- Faster speed grade than EP1K50FC484-1N (vs EP1K50FC484-1N)
- ACEX 1K architecture is now obsolete — modern designs should evaluate Cyclone series (vs Cyclone II EP2C50F484 (modern Altera/Intel))
Design Notes
The EP1K50FC484-2N requires a precise 2.5 V core supply (VCCINT). Estimated: at typical utilization (~70% LEs, 50% RAM blocks) the core draws approximately 200-300 mA; add I/O bank current (typically 50-150 mA per active bank at high toggle rates) to size the LDO. Do NOT substitute a 3.3 V regulator — exceeding 2.7 V on VCCINT damages the device. Use a TPS7A45xx-class LDO or equivalent with 1% set-point accuracy and bulk-decouple each VCCINT ball with a 0.1 µF X7R ceramic placed within 3 mm of the ball.
The 484-ball FBGA uses 1.0 mm ball pitch, requiring 4-6 layer PCB with microvia or via-in-pad construction for reliable BGA breakout. Per ACEX 1K family datasheet, all VCCINT and GND balls must be connected; floating power pins cause latch-up or unstable configuration. Route all signals in inner layers between BGA pads using microvia, and provide a continuous ground plane beneath the device to control impedance and reduce SSO (simultaneously-switching output) noise. BGA rework requires X-ray inspection or cross-sectioning to verify joint integrity.
ACEX 1K is SRAM-based and volatile — on power-up the FPGA loads configuration from an external serial EEPROM (EPC2, EPC4, or compatible). Estimated: typical configuration time for EP1K50 is 100-300 ms depending on data-compression settings. Designers must include the EPC2/EPC4 footprint even if only one bitstream is needed, or the board will fail to come up at power-on. Also: never leave JTAG TCK floating during board bring-up — a floating TCK can latch the FPGA into unintended test mode. Tie TCK low through a 1 kΩ pull-down if JTAG is unused.
ACEX 1K FPGAs in 484-ball FBGA have a typical θJA of ~15 C/W with proper PCB layout (continuous ground plane, thermal vias under the package). Estimated: at 200 MHz with 70% utilization, junction temperature rises 15-25 °C above ambient. For sealed enclosures without airflow, derate clock frequency or move to the lower-density EP1K30 to keep Tj below 125 °C commercial limit. Industrial-temperature variants (-1N, -2N with I suffix) extend operation to -40 to +100 °C but are increasingly scarce.
Compliance Information
N suffix in EP1K50FC484-2N indicates lead-free (Pb-free) ball composition per Altera/Intel legacy naming convention. RoHS compliance assumed for N-suffix ACEX 1K parts per Intel/Altera Pb-free transition programs; explicit RoHS certificate [DATA_NEEDED: request from franchised distributor]. AEC-Q100 not applicable — this is a commercial-grade FPGA; industrial-temp variants exist (e.g., EP1K50FI484-2N) but are not automotive-qualified.
