EP1K50FI484-2N - 50K-Gate ACEX 1K FPGA, 484-FBGA | Intel (Altera)
MPN: EP1K50FI484-2N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $45.5 | $45.50 |
| 10 | $41.2 | $412.00 |
| 100 | $36.8 | $3,680.00 |
| 500 | $32.5 | $16,250.00 |
| 1,000 | $28.9 | $28,900.00 |
Drop-in alternatives for EP1K50FI484-2N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1K50FI484-2
✅ Drop-In✓ In Stock
$23.95 / Unit
View Datasheet →EP1K50FC484-2N
✅ Drop-In✓ In Stock
$26.4 / Unit
View Datasheet →EP1K50FC484-3N
✅ Drop-In✓ In Stock
$19.5 / Unit
View Datasheet →EP1K100FI484-2N
✅ Drop-In✓ In Stock
$65 / Unit
View Datasheet →EP1K100FC484-2N
✅ Drop-In✓ In Stock
$58.4 / Unit
View Datasheet →EP1K50FI484-2N Maximum Ratings & Electrical Characteristics
| Family | ACEX 1K |
| Typical Gates | 50,000 |
| Logic Elements | 2,880 |
| Maximum Operating Frequency | 200 MHz |
| Process Technology | 0.22 µm CMOS |
| Core Voltage (VCCINT) | 2.5 V |
| I/O Voltage (VCCIO) | 2.5 V / 3.3 V (MultiVolt) |
| Embedded Memory (EAB) | 40,960 bits |
| User I/O Pins (max) | 333 |
| Package | 484-pin FBGA (FineLine BGA) |
| Operating Temperature | -40 °C to +85 °C (industrial) |
| Programming Interface | JTAG (IEEE 1149.1) / ByteBlaster |
| Mounting Type | Surface Mount |
| Speed Grade | -2 |
| Total Logic Elements (LE) | 2,880 |
EP1K50FI484-2N 484-pin fbga (fineline bga) Pin Configuration Guide
Complete pinout information for EP1K50FI484-2N (484-pin fbga (fineline bga) package) with 333 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1K50FI484-2N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 333 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1K50FI484-2N is suitable for 6 applications: Industrial Control and Factory Automation, PCI/ISA/VME Bus Bridging, Custom Peripheral Controllers in Embedded Designs, Digital Signal Processing Pre-Processing, Low-Volume ASIC Replacement in Telecom and Instrumentation, Glue Logic and System Integration.
Industrial Control and Factory Automation
The EP1K50FI484-2N suits industrial-control and factory-automation systems where it serves as a flexible glue-logic hub interfacing sensors, motor drivers, and human-machine interfaces to a central PLC or industrial PC. The 50K-gate capacity absorbs typical protocol-bridging (RS-232/RS-485 to parallel), quadrature-decoder logic, PWM-generation, and timing-critical state machines. Industrial-temperature qualification (-40 °C to +85 °C) is essential for factory-floor operation, and the 484-FBGA's thermal performance supports continuous duty. The ACEX 1K MultiVolt I/O allows direct interface to 5 V-tolerant peripherals via 3.3 V VCCIO banks, simplifying mixed-voltage panel designs.
Recommended
PCI/ISA/VME Bus Bridging
Legacy PCI, ISA, and VME bus systems often require custom bridging logic that the EP1K50FI484-2N provides cost-effectively. With 333 user I/Os, the part can implement a 32-bit PCI target with DMA engine, address decoding, and interrupt steering within its 2,880 logic elements. The 200 MHz internal rate and 40 kbit embedded RAM (EAB) handle buffering for short bursts. MultiVolt I/O banks allow direct 3.3 V PCI signalling and 5 V-tolerant legacy ISA/VME interfacing on the same die. Industrial temperature qualification suits factory-automation backplane applications.
Recommended
Custom Peripheral Controllers in Embedded Designs
In embedded designs the EP1K50FI484-2N functions as a custom peripheral controller, offloading timing-sensitive tasks such as LCD refresh, key-scanning, motor-control PWM, and sensor preprocessing from the main processor. Its 200 MHz capability supports real-time DSP pre-processing like FIR filters or motor-control algorithms. The 40 kbit EAB RAM enables small FIFO buffers between the FPGA and CPU without external SRAM, while 333 I/Os comfortably drive multi-port parallel interfaces. Industrial temperature makes it suitable for harsh-environment embedded systems such as outdoor signage controllers and vehicle telematics.
Recommended
Digital Signal Processing Pre-Processing
The EP1K50FI484-2N is well-suited to DSP pre-processing tasks such as data acquisition front-ends, digital decimation, FFT pre-conditioning, and baseband signal conditioning prior to a dedicated DSP. With 200 MHz toggle rate and 40 kbit embedded RAM, it can implement small FIR/IIR filters, gain stages, and channel-selection logic. The 484-FBGA package provides the I/O bandwidth required for parallel ADC/DAC interfaces (e.g., 12-14 bit, 50-100 MSPS), while industrial temperature qualification suits test-and-measurement instrumentation. Quartus II design tools support VHDL/Verilog DSP IP cores.
Recommended
Low-Volume ASIC Replacement in Telecom and Instrumentation
For low-to-mid volume ASIC replacements in telecom and test-and-measurement equipment, the EP1K50FI484-2N offers NRE-free programmability with 50K-gate capacity and industrial temperature qualification. The 484-FBGA package supports the high pin-count required for telecom backplane interfaces and instrument front-panel I/O. The ACEX 1K family supports in-system programmability via JTAG, enabling field updates and reconfiguration. For designs where 50K gates suffices but Cyclone II/III lifecycle support is preferred, migration to EP2C5 with PCB rework is recommended.
Recommended
Glue Logic and System Integration
The EP1K50FI484-2N is a workhorse for board-level glue logic: address decoding, chip-select generation, bus multiplexing, interrupt prioritization, and reset sequencing for complex multi-processor boards. The 2,880 logic elements and 333 user I/Os comfortably absorb typical north-bridge/south-bridge glue in industrial single-board computers and telecom line cards. The MultiVolt I/O interface allows direct connection to 2.5 V processors and 3.3 V peripherals without external level shifters, while the 484-FBGA package's high pin count suits backplane-edge designs.
Recommended
Recommended Products Summary
Engineering reference data for EP1K50FI484-2N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K50FI484-2 | EP1K50FC484-2N | EP1K50FC484-3N | EP1K100FI484-2N | EP1K100FC484-2N |
|---|---|---|---|---|---|---|
| Package | 484-pin FBGA | 484-pin FBGA - same | 484-pin FBGA - same | 484-pin FBGA - same | 484-pin FBGA - same | 484-pin FBGA - same |
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Typical Gates | 50,000 | 50,000 | 50,000 | 50,000 | 100,000 | 100,000 |
| Logic Elements | 2,880 | 2,880 | 2,880 | 2,880 | 4,992 | 4,992 |
| Max Frequency | 200 MHz | 200 MHz | 200 MHz | 250 MHz (faster speed grade) | 200 MHz | 200 MHz |
| Temperature Grade | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Industrial (-40C to +85C) | Commercial (0C to +70C) |
| Speed Grade | -2 | -2 | -2 | -3 (faster) | -2 | -2 |
| Embedded RAM (EAB) | 40,960 bits | 40,960 bits | 40,960 bits | 40,960 bits | 81,920 bits | 81,920 bits |
Key Differentiators
- Industrial temperature qualification (vs EP1K50FC484-2N)
- Speed grade -2 for power-friendliness (vs EP1K50FC484-3N)
- 50K-gate density tier (vs EP1K100FI484-2N)
Design Notes
Estimated: at 200 MHz with 50% toggle activity, VCCINT current draw is approximately 200–400 mA per the ACEX 1K datasheet family curves. With 2.5 V VCCINT, core power dissipation is roughly 0.5–1.0 W. Decoupling requires at least four 0.1 µF ceramic capacitors placed within 5 mm of each VCCINT ball cluster, plus a single bulk 47–100 µF tantalum or polymer capacitor on the supply rail. VCCIO bank rails (2.5 V or 3.3 V per bank) need their own local decoupling.
The 484-FBGA, 1.0 mm pitch package requires a 4–6 layer PCB stack-up with a continuous ground plane beneath the BGA. Use microvia-in-pad or dog-bone fan-out if via-in-pad is unavailable. Maintain 50 Ω controlled impedance on high-speed outputs (≥100 MHz) by using 4–5 mil trace widths on a standard FR-4 stack-up. Place JTAG and configuration signals on inner signal layers to keep top/bottom layers free for high-speed routing.
Estimated: at 1 W core dissipation, the 484-FBGA thermal resistance θJA is approximately 18–22 °C/W (with a standard JEDEC test board, no airflow), giving a 18–22 °C junction temperature rise. Industrial designs at 85 °C ambient need at least some airflow or thermal via array beneath the package exposed pad (if present in the specific BGA variant) to maintain a safe junction temperature. Use the Quartus II PowerPlay estimator for design-specific thermal analysis.
ACEX 1K MultiVolt I/O outputs have edge rates in the 1–3 ns range. For 3.3 V PCI or other 33–66 MHz synchronous interfaces, series-terminate outputs with 22–33 Ω resistors to dampen reflections on traces longer than 50 mm. Keep clock traces length-matched within ±2 mm across the bus. Use the IBIS model (available from Altera legacy support) for board-level simulation.
Critical pitfalls: (1) Do not apply 5 V to VCCINT - only 2.5 V is supported and over-voltage destroys the part. (2) Do not exceed the maximum JTAG TCK frequency (10 MHz typical, 16 MHz max). (3) Do not use ACEX 1K BSDL files for Cyclone II/III/IV parts - the BSDL is silicon-specific. (4) When migrating to EP2C5 (Cyclone II), confirm pin-out compatibility - the 484-FBGA ball map differs between ACEX 1K and Cyclone II.
Compliance Information
RoHS, REACH, lead-free, halogen-free status not confirmed in available data. The ACEX 1K family was introduced before RoHS took effect and many -2N variants ship with lead-bearing BGA finishes. Request a compliance certificate from the franchised distributor (e.g., Rochester Electronics) before shipping into RoHS-restricted markets. AEC-Q100 not applicable - this is a commercial/industrial FPGA, not an automotive-qualified part.
