EP1K50FI484-2N vs EP1K50FI484-2 Comparison

Detailed side-by-side comparison of EP1K50FI484-2N by Intel and EP1K50FI484-2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP1K50FI484-2N EP1K50FI484-2
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Family ACEX 1K ACEX 1K
Typical Gates 50,000 —
Logic Elements 2,880 2,880 cells
Maximum Operating Frequency 200 MHz 200 MHz
Process Technology 0.22 µm CMOS 0.22 µm CMOS
Core Voltage (VCCINT) 2.5 V —
I/O Voltage (VCCIO) 2.5 V / 3.3 V (MultiVolt) —
Embedded Memory (EAB) 40,960 bits —
User I/O Pins (max) 333 —
Package 484-pin FBGA (FineLine BGA) 484-pin FBGA (FineLine BGA)
Operating Temperature -40 °C to +85 °C (industrial) —
Programming Interface JTAG (IEEE 1149.1) / ByteBlaster —
Mounting Type Surface Mount —
RoHS Status [DATA_NEEDED: RoHS compliance status] Compliant
Speed Grade -2 —
Total Logic Elements (LE) 2,880 —
Equivalent Gates — 50,000
Core Supply Voltage — 2.5 V nominal (2.375 V - 2.625 V)
Combinatorial CLB Delay — 0.4 ns max
User I/O Pins — 249
Dedicated Input Pins — 6
Terminal Pitch — 1.00 mm
Embedded Memory — Dual-port RAM via Embedded Array Blocks (EABs)
Configuration Interface — JTAG (IEEE 1149.1), in-system programmable
Operating Temperature Grade — Industrial
JEDEC Package Code — S-PBGA-B484

Datasheets & Resources

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