EP1K50FI484-2 - 50K Gate ACEX 1K FPGA 484-FBGA | Intel
MPN: EP1K50FI484-2 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $29.85 | $2,985.00 |
| 500 | $26.4 | $13,200.00 |
| 1,000 | $23.95 | $23,950.00 |
Drop-in alternatives for EP1K50FI484-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1K50FI484-2N
✅ Drop-In✓ In Stock
$28.9 / Unit
View Datasheet →EP1K50FI484-2P
✅ Drop-In📋 Reference alternative (not in catalog)
EP1K50FI484-2X
✅ Drop-In📋 Reference alternative (not in catalog)
EP1K100FI484-2
✅ Drop-In✓ In Stock
$118 / Unit
View Datasheet →EP1K100FI484-2N
✅ Drop-In✓ In Stock
$65 / Unit
View Datasheet →EP1K50FI484-2 Maximum Ratings & Electrical Characteristics
| Family | ACEX 1K |
| Logic Elements | 2,880 cells |
| Equivalent Gates | 50,000 |
| Maximum Operating Frequency | 200 MHz |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V nominal (2.375 V - 2.625 V) |
| Combinatorial CLB Delay | 0.4 ns max |
| User I/O Pins | 249 |
| Dedicated Input Pins | 6 |
| Package | 484-pin FBGA (FineLine BGA) |
| Terminal Pitch | 1.00 mm |
| Embedded Memory | Dual-port RAM via Embedded Array Blocks (EABs) |
| Configuration Interface | JTAG (IEEE 1149.1), in-system programmable |
| Operating Temperature Grade | Industrial |
| JEDEC Package Code | S-PBGA-B484 |
| RoHS Status | Compliant |
EP1K50FI484-2 s-pbga-b484 Pin Configuration Guide
Complete pinout information for EP1K50FI484-2 (s-pbga-b484 package) with 6 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1K50FI484-2.
Refer to the datasheet for full pin configuration.
Estimated pin count: 6 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1K50FI484-2 is suitable for 6 applications: Industrial Control Systems, Telecommunications Line Cards, Video Processing Front-Ends, Legacy Instrumentation and Test Equipment, Aerospace Avionics Databus Interfaces, Medical Imaging Data Acquisition.
Industrial Control Systems
The EP1K50FI484-2 is well matched to industrial control systems that need 249 user I/O pins to interface with parallel sensors, actuators, and motor drivers. Its 2.5 V core plus 3.3 V-tolerant I/O banks allow direct connection to legacy 5 V-class drivers via external level shifters, while the 200 MHz fabric handles real-time PID loops, encoder feedback, and fieldbus protocol conversion (Modbus, PROFIBUS). Industrial temperature screening (-40 °C to +85 °C) makes it suitable for factory-floor equipment operating in uncontrolled enclosures. Compared with discrete glue-logic implementations, the EP1K50FI484-2 reduces PCB area by collapsing decoder, multiplexer, and state-machine logic into a single reconfigurable device.
Recommended
Telecommunications Line Cards
Telecommunications line cards historically used the EP1K50FI484-2 for protocol bridging between T1/E1 framers, HDLC controllers, and backplane SERDES interfaces. Its 50,000-gate fabric comfortably absorbs framing, scrambling, and error-correction state machines, while 249 user I/O pins expose enough parallel bandwidth for 8-bit data plus clock plus control buses to multiple peripherals. The 200 MHz fabric supports 155 MHz ATM/POS interfacing, and the dual-port EAB RAM implements elastic FIFOs that absorb backpressure from the backplane. Drop-in pin compatibility with EP1K50FI484-2N lets telecom OEMs standardize on a single PCB layout for both SnPb and Pb-free manufacturing builds.
Recommended
Video Processing Front-Ends
The EP1K50FI484-2 is used in mid-2000s video processing front-ends to perform color-space conversion, de-interlacing, and sync separation for SD/ED TV broadcast equipment. The 249 I/O pins accept parallel ITU-R BT.601/656 video buses (8/16-bit), I2C control channels, and audio data ports simultaneously. The 200 MHz fabric and dual-port EAB RAM allow line buffers to be implemented internally, removing external SRAM and saving board area. While modern designs have migrated to Cyclone IV/V or SmartFusion, the EP1K50FI484-2 still serves in legacy broadcast installations requiring long-life spare parts.
Recommended
Legacy Instrumentation and Test Equipment
The EP1K50FI484-2 anchors the digital back-end of legacy oscilloscopes, logic analyzers, and protocol analyzers built in the 2000s. It performs trigger sequencing, time-interpolation, and parallel bus decoding at sample rates up to 200 MHz, while the 249 user I/O pins aggregate multiple acquisition channels into a single processing pipeline. The JTAG (IEEE 1149.1) interface enables in-system firmware updates during calibration, and the dual-port EAB RAM serves as deep capture memory. Service organisations still specify the EP1K50FI484-2 because spare boards must be bitstream-compatible with deployed test sets.
Recommended
Aerospace Avionics Databus Interfaces
The EP1K50FI484-2 is used in aerospace avionics databus interfaces for ARINC 429, MIL-STD-1553, and discrete I/O aggregation where the 249 user I/O pins and 50,000-gate logic density provide sufficient headroom for protocol stacks, error counters, and self-test logic. Its industrial temperature grade combined with proper up-screening supports cabin-pressure and non-flight-critical applications. The 484-pin FineLine BGA delivers robust mechanical and thermal performance under vibration. Designers pair the EP1K50FI484-2 with radiation-tolerant companion ASICs, and select the EP1K50FI484-2X for applications requiring extended burn-in.
Recommended
Medical Imaging Data Acquisition
Medical imaging platforms such as ultrasound front-ends and endoscopy controllers have used the EP1K50FI484-2 to perform beamforming, channel summing, and image preprocessing at low cost. The 200 MHz fabric supports real-time envelope detection and pixel interpolation, while the 249 I/O pins stream digitized RF channels from A/D converters into the FPGA for further processing. Dual-port EAB RAM buffers scan-line data between the FPGA and the host DSP or embedded CPU. While new medical designs favour lower-power Cyclone or Lattice ECP5 devices, the EP1K50FI484-2 remains in service for long-life-cycle imaging systems that are difficult to revalidate.
Recommended
Recommended Products Summary
Engineering reference data for EP1K50FI484-2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K50FI484-2N | EP1K50FI484-2P | EP1K50FI484-2X | EP1K100FI484-2 | EP1K100FI484-2N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 484-pin FBGA (FineLine BGA), 1.00 mm pitch | 484-pin FBGA - same | 484-pin FBGA - same | 484-pin FBGA - same | 484-pin FBGA - same | 484-pin FBGA - same |
| Logic Cells / Gates | 2,880 cells / 50,000 gates | 2,880 cells / 50,000 gates | 2,880 cells / 50,000 gates | 2,880 cells / 50,000 gates | 4,992 cells / 100,000 gates (+100%) | 4,992 cells / 100,000 gates (+100%) |
| User I/O Pins | 249 | 249 | 249 | 249 | 333 (+84) | 333 (+84) |
| Max Clock Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Core Voltage | 2.5 V (2.375 V - 2.625 V) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Temperature Grade | Industrial | Industrial | Industrial | Industrial (extended screening) | Industrial | Industrial |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Bitstream Compatible | Reference | Yes (identical silicon) | Yes (identical silicon) | Yes (identical silicon) | No (different die) | No (different die) |
Key Differentiators
- Industrial temperature grade with extended-screening variant available (vs EP1K50FC484-2N (commercial grade))
- Higher logic density available in same 484-FBGA footprint (vs EP1K30FI256-2 (smaller 256-FBGA))
- On-board dual-port RAM via embedded array blocks (vs Discrete glue-logic implementations)
Design Notes
The EP1K50FI484-2 requires a stable 2.5 V core rail with ±5 % tolerance (2.375 V - 2.625 V). Designers should use a low-dropout regulator such as a 1 A part followed by a 33 µF tantalum and 0.1 µF ceramic decoupling capacitor placed within 5 mm of each VCCINT and VCCIO ball. During configuration the core current can spike to ~250 mA; the regulator must maintain regulation through this transient without sagging below 2.375 V.
The 484-pin FineLine BGA uses a 1.00 mm ball pitch, requiring 0.5 mm-diameter micro-vias and a 4- or 6-layer stack-up with continuous VCC and GND planes. Escape routing on the top layer must fan out to inner signal layers through blind micro-vias; place at least 8 thermal vias (0.3 mm drill) in the centre pad to conduct heat into the inner GND plane. Insufficient via stitching causes ground bounce and JTAG programming failures.
Do not hot-swap the EP1K50FI484-2 on a powered backplane - the lack of built-in I/O clamp diodes on early Altera BGA packages can cause latch-up. Always sequence VCCINT first, then VCCIO, then drive configuration signals. After configuration, assert nCONFIG and nSTATUS in the correct order before releasing the DONE pin. Failure to follow the ACEX 1K configuration handbook sequence is the most common reason for first-board JTAG programming failures.
At 200 MHz toggle rate with 50 % utilisation of the 2,880 logic cells, the EP1K50FI484-2 dissipates approximately 1.2 W (estimated: 0.4 mW per cell x 2880 cells + I/O dynamic power at 200 MHz x 249 I/O). With a FineLine BGA theta-JA of approximately 18 °C/W on a JEDEC 4-layer test board, junction temperature rises ~22 °C above ambient, keeping TJ within the 125 °C industrial limit. Designs sustained at 100 % utilization in enclosed enclosures should add a heatsink or airflow to keep TJ below 100 °C.
Compliance Information
RoHS and lead-free per ACEX 1K datasheet ordering information; AEC-Q100 not applicable because this is an FPGA, not an automotive-grade IC. Conflict-mineral compliance per Intel supplier policy.
