EP1SGX25F672C7 vs EP1SGX25CF672I7 Comparison

Detailed side-by-side comparison of EP1SGX25F672C7 by Intel and EP1SGX25CF672I7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP1SGX25F672C7 EP1SGX25CF672I7
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Family Stratix GX Stratix GX
Logic Elements 25,660 25,660
Total RAM Bits 1,944,576 —
User I/Os 455 —
Number of LABs/CLBs 2566 —
Package 672-FBGA (27 x 27 mm, 1.0 mm pitch) 672-FBGA (FC-FBGA, FineLine BGA)
Speed Grade -7 —
Core Voltage 1.5 V —
Transceivers 4 channels —
Transceiver Data Rate Up to 3.125 Gbps —
PLLs 8 —
Operating Temperature 0 C to 85 C —
Mounting Type Surface Mount Surface Mount (BGA)
Lead Free Yes —
Process Technology CMOS, SRAM-based LUT 130 nm CMOS
Embedded Hard IP PCI Express, Gigabit Ethernet, Serial RapidIO —
Combinational Logic Blocks (CLBs) — 2,566
Total Memory Bits — 1,944,576
LAB/CLB Rows — 455
Maximum Clock Frequency — 4385.97 MHz (one source: 4.7 MHz)
Combinatorial Delay (CLB) — 9.48 ns (sibling datasheet figure)
Nominal Core Voltage — 1.5 V
Operating Temperature Range — -65C to +135C (Military)
Ball Count — 672
Ball Pitch — 1.00 mm
Package Body Size — 27.00 x 27.00 mm
RoHS Status — unknown
Programming Toolchain — Quartus II / Quartus Prime

Datasheets & Resources

Browse All Products Create BOM Request Quote