EP1SGX25CF672I7 - Stratix GX 25K LEs, 672-FBGA FPGA | Intel
MPN: EP1SGX25CF672I7 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245 | $24,500.00 |
| 500 | $220 | $110,000.00 |
| 1,000 | $198.5 | $198,500.00 |
Drop-in alternatives for EP1SGX25CF672I7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1SGX25CF672I7N
✅ Drop-In✓ In Stock
$171 / Unit
View Datasheet →EP1SGX25CF672I6N
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$171 / Unit
View Datasheet →EP1SGX25CF672I6
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$171 / Unit
View Datasheet →EP1SGX25CF672C7N
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$338.5 / Unit
View Datasheet →EP1SGX25CF672C7
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$340 / Unit
View Datasheet →EP1SGX25CF672I7 Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Logic Elements | 25,660 |
| Combinational Logic Blocks (CLBs) | 2,566 |
| Total Memory Bits | 1,944,576 |
| LAB/CLB Rows | 455 |
| Maximum Clock Frequency | 4385.97 MHz (one source: 4.7 MHz) |
| Combinatorial Delay (CLB) | 9.48 ns (sibling datasheet figure) |
| Nominal Core Voltage | 1.5 V |
| Process Technology | 130 nm CMOS |
| Operating Temperature Range | -65C to +135C (Military) |
| Package | 672-FBGA (FC-FBGA, FineLine BGA) |
| Ball Count | 672 |
| Ball Pitch | 1.00 mm |
| Package Body Size | 27.00 x 27.00 mm |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | unknown |
| Programming Toolchain | Quartus II / Quartus Prime |
EP1SGX25CF672I7 27.00 x 27.00 mm Pin Configuration Guide
Complete pinout information for EP1SGX25CF672I7 (27.00 x 27.00 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX25CF672I7.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25CF672I7 is suitable for 6 applications: High-Speed Serial Interface Bridging (XAUI, RapidIO), Telecom Line Card Aggregation, Military and Aerospace Signal Processing, ASIC Prototyping and Emulation, Industrial Imaging and Machine Vision, Test and Measurement Instrumentation.
High-Speed Serial Interface Bridging (XAUI, RapidIO)
The Stratix GX fabric of the EP1SGX25CF672I7 integrates dedicated multi-gigabit transceivers that natively support XAUI (10 Gbps across four lanes), Serial RapidIO, PCI Express, and Fibre Channel. With 25,660 logic elements, designers can implement full PCS logic, lane alignment, and link-training state machines on-die, eliminating external PHY ICs. The 672-FBGA package exposes all transceiver ball assignments required for 4-8 SERDES channels. Power consumption scales with active lane count, so unused transceivers must be powered down to meet the 1.5 V core thermal envelope.
Recommended
Telecom Line Card Aggregation
Telecommunications line cards use the EP1SGX25CF672I7 to aggregate multiple lower-rate serial links into higher-speed backplanes while performing framing, encryption, and traffic shaping in the fabric. The 1,944,576 embedded memory bits serve as packet buffers and queue structures, and the 2,566 CLBs provide the parallelism needed for multi-channel header processing. The Military temperature grade -65C to +135C makes the device attractive for outdoor cabinet deployments where commercial-grade parts would derate. Reference designs in the Stratix GX handbook show full SONET/SDH mapping using this fabric.
Recommended
Military and Aerospace Signal Processing
The -65C to +135C Military temperature grade of the EP1SGX25CF672I7 makes it well-suited to avionics, radar front-end preprocessing, and electronic-warfare subsystems. Its 25,660 LEs and 1.5 V core allow DSP-rich designs such as digital downconverters, FIR filter banks, and beamforming engines. The 672-FBGA with 1.00 mm pitch is compatible with standard aerospace PCB processes using microvia stacks. Designers should request per-lot MIL-STD-883 screening documentation from brokers since the part is obsolete.
Recommended
ASIC Prototyping and Emulation
Design teams use the EP1SGX25CF672I7 as an ASIC prototyping vehicle, mapping large RTL designs into the 25,660 LE fabric to validate functionality before tape-out. The Stratix GX memory hierarchy and dedicated multiplier blocks accelerate DSP-heavy emulations. Multiple FPGAs can be paralleled on a single board, communicating through the SERDES channels on the 672-FBGA package. This application typically operates at lower internal clock rates to balance timing closure across many FPGAs.
Recommended
Industrial Imaging and Machine Vision
Industrial camera and machine-vision platforms benefit from the parallel pixel pipelines achievable on the EP1SGX25CF672I7. The 25,660 LEs can sustain multi-stream Camera Link or CoaXPress aggregation, with on-die memory buffering entire frame rows before downstream compression. The 1.5 V core voltage keeps power-per-pixel competitive with newer FPGAs, and the Military temperature grade supports outdoor factory deployments. Industrial designers often pair this part with external SDRAM for frame-store memory.
Recommended
Test and Measurement Instrumentation
Test instruments such as protocol analyzers, BER testers, and logic analyzers use the EP1SGX25CF672I7 to generate and capture high-speed serial traffic with deep trace memory. The 1,944,576 embedded bits buffer captured events, and the SERDES macros handle multi-gigabit capture without external PHYs. The Military temperature grade allows operation in environmental test chambers. The 672-FBGA package fits standard FPGA development boards that engineers can re-purpose for custom protocol test.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25CF672I7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25CF672I7N | EP1SGX25CF672I6N | EP1SGX25CF672I6 | EP1SGX25CF672C7N | EP1SGX25CF672C7 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-FBGA (FC-FBGA) | 672-FBGA (FC-FBGA) - same | 672-FBGA (FC-FBGA) - same | 672-FBGA (FC-FBGA) - same | 672-FBGA (FC-FBGA) - same | 672-FBGA (FC-FBGA) - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Total Memory Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| Temperature Grade | Military (-65C to +135C) | Military (-65C to +135C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | I7 | I7 | I6 (-15% timing margin) | I6 (-15% timing margin) | C7 | C7 |
| Terminal Finish | SnPb (ball) | Pb-free | Pb-free | SnPb (ball) | Pb-free | SnPb (ball) |
| Logic Cells / CLBs | 25,660 LEs / 2,566 CLBs | 25,660 LEs / 2,566 CLBs | 25,660 LEs / 2,566 CLBs | 25,660 LEs / 2,566 CLBs | 25,660 LEs / 2,566 CLBs | 25,660 LEs / 2,566 CLBs |
Key Differentiators
- Lead-free terminal finish for RoHS-compliant assembly (vs EP1SGX25CF672I7N)
- Highest speed grade in 672-FBGA family (vs EP1SGX25CF672I6N)
- Military temperature grade for harsh environments (vs EP1SGX25CF672C7N)
Design Notes
The 1.5 V core rail of the EP1SGX25CF672I7 typically draws several hundred milliamps plus substantial current on the SERDES analog supplies (VCCA, VCCP, VCCR) when transceivers are active. Decouple each rail with a 10 uF bulk plus 0.1 uF / 1 nF high-frequency caps within 5 mm of each BGA ball cluster. Place ferrite beads on analog supplies to isolate switching noise from PLL-sensitive circuits.
The 1.00 mm pitch FC-FBGA-672 requires 6-layer PCB minimum with microvia (laser-drilled) stack-up to break out all signals. Use a fanout pattern with via-in-pad for inner-row power and ground; route SERDES differential pairs with 100 ohm differential impedance and length matching within 0.15 mm. Maintain a continuous reference plane under SERDES lanes to control return-path discontinuities.
The Military temperature grade -65C to +135C allows wide operating range, but the junction temperature still must stay within the silicon limit. With 25,660 LEs and active SERDES, attach a heatsink or thermal pad over the BGA center array. Without thermal management, the part can exceed the 135C junction temperature limit and trigger internal thermal shutdown.
Since the EP1SGX25CF672I7 is obsolete, several risks apply: counterfeit parts, refurbished or remarked units, and lack of datasheet updates. Insist on traceability documentation, third-party testing (such as decapsulation or X-ray), and purchase only from brokers that provide Certificates of Conformance. Be aware that the Quartus II toolchain is no longer actively supported by Intel for new versions.
Compliance Information
RoHS compliance not stated in Verified Web Data; the base part uses SnPb ball finish and is therefore not RoHS by default. The 'N' suffix variants (e.g. EP1SGX25CF672I7N) are typically the Pb-free / RoHS-compatible options. AEC-Q100 not applicable (this is an FPGA, not an automotive IC). MIL-STD-883 screening status must be requested from broker per lot.
