EP1SGX25F672C7 - 25K LE Stratix GX FPGA, 672-BGA, -7 Speed | Intel
MPN: EP1SGX25F672C7 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268 | $2,680.00 |
| 100 | $245 | $24,500.00 |
| 500 | $225 | $112,500.00 |
| 1,000 | $210 | $210,000.00 |
Drop-in alternatives for EP1SGX25F672C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1SGX25CF672C7
✅ Drop-In✓ In Stock
$340 / Unit
View Datasheet →EP1SGX25CF672C7N
✅ Drop-In✓ In Stock
$338.5 / Unit
View Datasheet →EP1SGX25DF672C7
✅ Drop-In✓ In Stock
$125.4 / Unit
View Datasheet →EP1SGX25DE672C7
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP1SGX25F672C6
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$175 / Unit
View Datasheet →EP1SGX25CF672I7
✅ Drop-In✓ In Stock
$198.5 / Unit
View Datasheet →EP1SGX10CF672C7
✅ Drop-In✓ In Stock
$185 / Unit
View Datasheet →EP1SGX25F672C7 Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Logic Elements | 25,660 |
| Total RAM Bits | 1,944,576 |
| User I/Os | 455 |
| Number of LABs/CLBs | 2566 |
| Package | 672-FBGA (27 x 27 mm, 1.0 mm pitch) |
| Speed Grade | -7 |
| Core Voltage | 1.5 V |
| Transceivers | 4 channels |
| Transceiver Data Rate | Up to 3.125 Gbps |
| PLLs | 8 |
| Operating Temperature | 0 C to 85 C |
| Mounting Type | Surface Mount |
| Lead Free | Yes |
| Process Technology | CMOS, SRAM-based LUT |
| Embedded Hard IP | PCI Express, Gigabit Ethernet, Serial RapidIO |
EP1SGX25F672C7 672-fbga (27 x 27 mm, 1.0 mm pitch) Pin Configuration Guide
Complete pinout information for EP1SGX25F672C7 (672-fbga (27 x 27 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX25F672C7.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25F672C7 is suitable for 6 applications: SONET/SDH Framer Implementations, Serial RapidIO Switch / Endpoint, XAUI-to-XAUI Bridge / 10G Ethernet Pre-Processor, PCI Express Endpoint Card, ASIC Prototyping for Networking ASICs, Base-Station Digital Front-End Signal Processing.
SONET/SDH Framer Implementations
The EP1SGX25F672C7 fits SONET/SDH framer designs because its 4 embedded multi-gigabit transceivers operate up to 3.125 Gbps, matching OC-48/STM-16 line rates. The 25,660 logic elements and embedded hard IP such as POS-PHY Level 4 reduce manual RTL effort for framer overhead processing. Placed between the line interface and the network processor, the FPGA performs framing, scrambling, and defect monitoring while consuming less than 1.5 W per transceiver channel at full utilization. Compared with an ASIC approach the GX family delivers shorter time-to-market for evolving SONET/SDH feature sets.
Recommended
Serial RapidIO Switch / Endpoint
Serial RapidIO links at 1.25 Gbaud, 2.5 Gbaud, and 3.125 Gbaud map directly onto the EP1SGX25F672C7 transceiver channels, making it a common choice for baseband DSP clustering. The 1,944,576 RAM bits provide packet buffering for cut-through switch designs, and 455 user I/Os accommodate parallel DSP or host CPU interfaces. Compared with discrete SERDES chips, the integrated transceivers cut board area and reduce bill-of-material cost in wireless base-station cards.
Recommended
XAUI-to-XAUI Bridge / 10G Ethernet Pre-Processor
Four transceiver lanes at 3.125 Gbps aggregate to a 10 Gbps XAUI link that the EP1SGX25F672C7 can terminate and bridge to a custom parallel interface. Hard IP for 10 Gigabit Ethernet (XGMII) reduces logic consumption by approximately 8K LE, leaving headroom for MAC or encryption accelerators. The 672-FBGA package provides ample signal escape for four differential XAUI lanes plus 32-bit parallel datapath. Designers appreciate the Dynamic Phase Alignment feature that absorbs up to 18 UI of skew across channels.
Recommended
PCI Express Endpoint Card
The EP1SGX25F672C7 implements a single-lane PCI Express x1 endpoint using the embedded hard IP, operating at 2.5 Gbps per lane. Embedded transceivers free up to 2K LE compared with a soft SERDES approach, accelerating timing closure. Placed on a host adapter card, the FPGA bridges PCIe to user logic via PIPE or custom Avalon/AMBA interfaces. The 455 user I/Os are sufficient for adding protocol-specific glue logic, DMA engines, and debug interfaces.
Recommended
ASIC Prototyping for Networking ASICs
Engineers use the EP1SGX25F672C7 to prototype networking ASICs because the multi-gigabit transceivers match typical ASIC pad ring speeds and the 25,660 LE capacity fits medium-scale ASIC RTL partitions. Quartus II supports gate-level netlist flow for ASIC RTL, and the 672-FBGA package accommodates breakout boards that mimic ASIC BGA pads. Compared with emulation-only platforms, the production silicon run yields faster software bring-up and hardware validation of PHY-MAC interactions.
Recommended
Base-Station Digital Front-End Signal Processing
The DSP blocks and high-speed transceivers of the EP1SGX25F672C7 suit base-station DFE cards performing crest-factor reduction (CFR), digital pre-distortion (DPD), and IQ modulation. With 4 transceiver channels and embedded DSP blocks delivering up to 224 GMACS, the device handles multi-carrier LTE signal chains. The 672-FBGA package dissipates up to 6 W at full utilization, requiring a thermal pad or modest airflow. Compared with discrete DSP farms, the integrated transceivers reduce PCB layer count by 2 to 4.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25F672C7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25CF672C7 | EP1SGX25CF672C7N | EP1SGX25DF672C7 | EP1SGX25DE672C7 | EP1SGX25F672C6 | EP1SGX25CF672I7 | EP1SGX10CF672C7 |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-FBGA | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | ~10,670 |
| Speed Grade | -7 | -7 | -7 | -7 | -7 | -6 | -7 | -7 |
| Transceivers | 4 channels | 4 channels | 4 channels | 4 channels | 4 channels | 4 channels | 4 channels | 4 channels |
| Transceiver Data Rate | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 6.375 Gbps (enhanced) | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps |
| Operating Temperature | 0 C to 85 C (commercial) | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | -40 C to +100 C (industrial) | 0 C to 85 C |
| User I/Os | 455 | 455 | 455 | 455 | 455 | 455 | 455 | ~350 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Identical die in -7 commercial speed grade (vs EP1SGX25CF672C7)
- Enhanced transceiver data rate capability (vs EP1SGX25DF672C7)
- Industrial temperature alternative available (vs EP1SGX25CF672I7)
- Lower-cost lower-density option (vs EP1SGX10CF672C7)
Design Notes
Estimated: at full transceiver utilization with 4 channels active at 3.125 Gbps and logic utilization around 70 percent, total power dissipation reaches 6 to 8 W. With 27 mm x 27 mm FBGA package thermal resistance theta_JA of approximately 12 C/W on a standard 8-layer PCB, junction temperature can rise 75 to 95 C above ambient. A thermal pad bonded to an inner ground plane or modest 100 LFM airflow is recommended for reliable commercial-temperature operation.
Allocate dedicated PCB layers for the transceiver power rails (VCCA, VCCP) and reference clock distribution. Use 100 ohm differential impedance for serial lanes and follow the Stratix GX handbook via-keep-out pattern beneath the FBGA ball field. Place 0.1 uF and 0.01 uF decoupling capacitors within 100 mil of every power pin to minimize SSO noise on the 1.5 V core rail.
Differential transceiver traces should be length-matched to within 5 mil across each lane and the receiver lanes must be length-matched within 100 mil across all four channels. Use Dynamic Phase Alignment (DPA) only if inter-channel skew exceeds 18 UI, otherwise static phase alignment saves logic and timing margin. Reference clock traces should be guarded by ground pours on both sides with no signal crossovers.
Do not use the EP1SGX25F672C7 with Quartus versions newer than 13.0 because Intel discontinued Stratix GX support in subsequent Quartus releases. When migrating to Stratix II GX EP2SGX25, expect a Quartus re-compile plus a board-level power-sequence review because the transceiver pinout and the VCCIO bank voltages are not pin-compatible. Always verify the date code against Intel last-time-buy announcements before placing volume orders.
Compliance Information
RoHS and lead-free per Altera/Intel marking on the 672-FBGA package; JEDEC J-STD-020 MSL3 reflow compliance. AEC-Q100 not applicable because the part targets commercial communications infrastructure, not automotive.
