EP20K400EBC652-3 vs EP20K400EBI652-2X Comparison
Detailed side-by-side comparison of EP20K400EBC652-3 by Intel and EP20K400EBI652-2X by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP20K400EBC652-3 | EP20K400EBI652-2X |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last Time Buy | Obsolete |
| Family | APEX 20KE | APEX 20K |
| Series / Device | EP20K400E | — |
| Logic Elements / Cells | 16,640 | — |
| System Gates | 400,000 | — |
| Embedded Memory (bits) | 212,992 | — |
| User I/Os | 488 | — |
| User Pins (per datasheet summary) | 502 | — |
| Process Technology | 0.22 µm CMOS | 0.22 µm CMOS |
| Core Supply Voltage | 1.8 V | 1.8 V |
| I/O Supply Voltage | 2.5 V | — |
| Propagation Delay | 2.5 ns | — |
| Max Internal Frequency | 213 MHz | — |
| Speed Grade | -3 | — |
| Package | 652-ball BGA (BC-652) | 652-ball FineLine BGA (thermally enhanced) |
| Operating Temperature | 0 °C to 85 °C (commercial) | [DATA_NEEDED: operating temperature grade] |
| Mounting Type | Surface Mount | — |
| RoHS Status | [DATA_NEEDED: rohs_status] | [DATA_NEEDED: RoHS status] |
| Logic Elements (Macros) | — | 1664 |
| Maximum Logic Gates | — | 400,000 |
| Logic Cells | — | 16,640 |
| User I/O Pins | — | 488 |
| Maximum Operating Frequency | — | 223 MHz |
| Package Body Size | — | 45 mm x 45 mm |
| On-chip Memory | — | Embedded Array Blocks (EAB) |
| Interconnect Structure | — | Four-level hierarchical FastTrack |
| Configuration Modes | — | Passive Serial, Passive Parallel, JTAG |