EP20K400EBC652-3 vs EP20K400EBI652-2X Comparación
Comparación detallada lado a lado de EP20K400EBC652-3 por Intel y EP20K400EBI652-2X por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP20K400EBC652-3 | EP20K400EBI652-2X |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $210,00 | $115,00 |
| Family | APEX 20KE | APEX 20K |
| Series / Device | EP20K400E | — |
| Logic Elements / Cells | 16,640 | — |
| System Gates | 400,000 | — |
| Embedded Memory (bits) | 212,992 | — |
| User I/Os | 488 | — |
| User Pins (per datasheet summary) | 502 | — |
| Process Technology | 0.22 µm CMOS | 0.22 µm CMOS |
| Core Supply Voltage | 1.8 V | 1.8 V |
| I/O Supply Voltage | 2.5 V | — |
| Propagation Delay | 2.5 ns | — |
| Max Internal Frequency | 213 MHz | — |
| Speed Grade | -3 | — |
| Encapsulado | 652-ball BGA (BC-652) | 652-ball FineLine BGA (thermally enhanced) |
| Temperatura de funcionamiento | 0 °C to 85 °C (commercial) | [DATA_NEEDED: operating temperature grade] |
| Tipo de montaje | Surface Mount | — |
| Estado RoHS | [DATA_NEEDED: rohs_status] | [DATA_NEEDED: RoHS status] |
| Logic Elements (Macros) | — | 1664 |
| Maximum Logic Gates | — | 400,000 |
| Logic Cells | — | 16,640 |
| User I/O Pins | — | 488 |
| Maximum Operating Frequency | — | 223 MHz |
| Package Body Size | — | 45 mm x 45 mm |
| On-chip Memory | — | Embedded Array Blocks (EAB) |
| Interconnect Structure | — | Four-level hierarchical FastTrack |
| Configuration Modes | — | Passive Serial, Passive Parallel, JTAG |