EP20K60EFC324-3 vs EP20K60EFC324-2X Comparison
Detailed side-by-side comparison of EP20K60EFC324-3 by Intel and EP20K60EFC324-2X by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP20K60EFC324-3 | EP20K60EFC324-2X |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Series | APEX 20KE | — |
| Family | APEX 20K | APEX-20KE |
| Logic Elements / Cells | 2560 | — |
| Total Gates | 60000 | — |
| User I/Os | 196 | — |
| Number of Logic Blocks / LABs | 256 | — |
| Embedded Memory (EAB/ESB) Bits | 24576 | — |
| Internal Frequency (max) | 160 MHz | — |
| Propagation Delay | 1.72 ns | — |
| Peak Performance Frequency | 182 MHz | — |
| Core Voltage (VCCINT) | 1.8 V (1.71 V to 1.89 V) | — |
| I/O Voltage (VCCIO) | 3.3 V (3.0 V to 3.6 V) | — |
| Process Technology | 0.22 µm CMOS | — |
| Logic Family | CMOS | — |
| Package / Case | 324-FBGA (19x19 mm, 1.0 mm pitch) | — |
| Operating Temperature | 0°C to +85°C (commercial) | — |
| Mounting Type | Surface Mount | — |
| Programmable Type | In-system programmable (SRAM) | — |
| Configuration Interface | JTAG (IEEE 1149.1) + passive serial | — |
| RoHS Status | unknown | [DATA_NEEDED: RoHS compliance] |
| Number of Logic Elements (LEs) | — | 2,560 |
| Typical Gates | — | 60,000 |
| Total RAM Bits | — | 32,768 |
| Number of I/O Pins | — | 196 |
| Number of Embedded System Blocks (ESBs) | — | 16 |
| Number of PLLs | — | 4 |
| Core Voltage | — | 1.71 V to 1.89 V |
| MultiVolt I/O Support | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Package Type | — | 324-FBGA (Fine-pitch BGA) |
| Package Dimensions | — | 19 mm × 19 mm |
| Operating Temperature Grade | — | Industrial (per -2 speed suffix) |
| Configuration Mode | — | Passive Serial / Passive Parallel (Async & Sync) |
| In-System Programming | — | Yes (IEEE 1149.1 JTAG) |