EP2A25F672C7 vs EP2A25F672C8N Comparison
Detailed side-by-side comparison of EP2A25F672C7 by Altera and EP2A25F672C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2A25F672C7 | EP2A25F672C8N |
|---|---|---|
| Brand | Altera | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | NRND | NRND |
| Product Family | APEX II | — |
| Logic Elements | 25,000 | — |
| Maximum System Gates | 1,650,000 | — |
| Maximum RAM Bits | 422,976 | — |
| User I/O Count | 492 | — |
| Package | 672-ball FCBGA (FineLine BGA) | 672-ball FC-FBGA (FineLine BGA) |
| Process Technology | 0.15-um all-layer copper, up to 8 metal layers | — |
| Supply Voltage (Core) | 1.5 V | — |
| LVDS Data Rate | 1 Gbps per channel (True-LVDS) | — |
| I/O Standards Supported | LVDS, LVPECL, PCML, HyperTransport | — |
| Operating Temperature | 0C to +85C (Commercial) | 0 C to 85 C (commercial) |
| Speed Grade | -7 | C8 |
| Configuration Mode | Passive Serial, Passive Parallel, JTAG | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | Compliant |
| Embedded System Blocks (ESB) | Yes - RAM, ROM, CAM, multiplier support | — |
| Family | — | APEX II |
| Technology Node | — | 0.15 um all-layer copper process |
| System Gates | — | 900,000 |
| Logic Elements / Cells | — | 24,320 |
| Maximum Internal Frequency | — | 333 MHz |
| Propagation Delay | — | 1.69 ns |
| User I/Os | — | 492 |
| Package Body Size | — | 27 x 27 mm |
| Ball Pitch | — | 1.0 mm |
| Core Supply Voltage | — | 1.5 V |
| Multi-Gigabit Transceiver Rate | — | Up to 1 Gbps per channel |
| Mounting Type | — | Surface Mount |
| Lead-Free Suffix | — | N (lead-free, Pb-free finish) |