EP2A25F672C7 vs EP2A25F672C8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2A25F672C7 sa pamamagitan ng Altera at EP2A25F672C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2A25F672C7 | EP2A25F672C8N |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Product Family | APEX II | — |
| Logic Elements | 25,000 | — |
| Maximum System Gates | 1,650,000 | — |
| Maximum RAM Bits | 422,976 | — |
| User I/O Count | 492 | — |
| Packhaging | 672-ball FCBGA (FineLine BGA) | 672-ball FC-FBGA (FineLine BGA) |
| Process Technology | 0.15-um all-layer copper, up to 8 metal layers | — |
| Supply Voltage (Core) | 1.5 V | — |
| LVDS Data Rate | 1 Gbps per channel (True-LVDS) | — |
| I/O Standards Supported | LVDS, LVPECL, PCML, HyperTransport | — |
| Temperature na Operasyon | 0C to +85C (Commercial) | 0 C to 85 C (commercial) |
| Speed Grade | -7 | C8 |
| Configuration Mode | Passive Serial, Passive Parallel, JTAG | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Embedded System Blocks (ESB) | Yes - RAM, ROM, CAM, multiplier support | — |
| Family | — | APEX II |
| Technology Node | — | 0.15 um all-layer copper process |
| System Gates | — | 900,000 |
| Logic Elements / Cells | — | 24,320 |
| Maximum Internal Frequency | — | 333 MHz |
| Propagation Delay | — | 1.69 ns |
| User I/Os | — | 492 |
| Package Body Size | — | 27 x 27 mm |
| Ball Pitch | — | 1.0 mm |
| Core Supply Voltage | — | 1.5 V |
| Multi-Gigabit Transceiver Rate | — | Up to 1 Gbps per channel |
| Uri ng Pagpapasok | — | Surface Mount |
| Lead-Free Suffix | — | N (lead-free, Pb-free finish) |