EP2A25F672C7 vs EP2A25F672C8N Comparación
Comparación detallada lado a lado de EP2A25F672C7 por Altera y EP2A25F672C8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2A25F672C7 | EP2A25F672C8N |
|---|---|---|
| Marca | Altera | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $118,00 | $205,00 |
| Product Family | APEX II | — |
| Logic Elements | 25,000 | — |
| Maximum System Gates | 1,650,000 | — |
| Maximum RAM Bits | 422,976 | — |
| User I/O Count | 492 | — |
| Encapsulado | 672-ball FCBGA (FineLine BGA) | 672-ball FC-FBGA (FineLine BGA) |
| Process Technology | 0.15-um all-layer copper, up to 8 metal layers | — |
| Supply Voltage (Core) | 1.5 V | — |
| LVDS Data Rate | 1 Gbps per channel (True-LVDS) | — |
| I/O Standards Supported | LVDS, LVPECL, PCML, HyperTransport | — |
| Temperatura de funcionamiento | 0C to +85C (Commercial) | 0 C to 85 C (commercial) |
| Speed Grade | -7 | C8 |
| Configuration Mode | Passive Serial, Passive Parallel, JTAG | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Embedded System Blocks (ESB) | Yes - RAM, ROM, CAM, multiplier support | — |
| Family | — | APEX II |
| Technology Node | — | 0.15 um all-layer copper process |
| System Gates | — | 900,000 |
| Logic Elements / Cells | — | 24,320 |
| Maximum Internal Frequency | — | 333 MHz |
| Propagation Delay | — | 1.69 ns |
| User I/Os | — | 492 |
| Package Body Size | — | 27 x 27 mm |
| Ball Pitch | — | 1.0 mm |
| Core Supply Voltage | — | 1.5 V |
| Multi-Gigabit Transceiver Rate | — | Up to 1 Gbps per channel |
| Tipo de montaje | — | Surface Mount |
| Lead-Free Suffix | — | N (lead-free, Pb-free finish) |