EP2A40F33I-7 vs EP2A40B724I-7 Comparison

Detailed side-by-side comparison of EP2A40F33I-7 by Intel and EP2A40B724I-7 by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2A40F33I-7 EP2A40B724I-7
Brand Intel Altera
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $119.00 $158.00
Device Family APEX II (EP2A) β€”
Device Member EP2A40 (high-density) β€”
Logic Elements [DATA_NEEDED: logic element count] 40,000 LE
Package Type Fine-pitch BGA (FBGA) β€”
Package Pin/Ball Count 33 balls β€”
Pitch [DATA_NEEDED: ball pitch] β€”
Operating Temperature Grade Industrial (-40 C to +85 C) Industrial (-40C to +100C)
Peak Reflow Temperature 220 C (Pb-free profile) 220 C
Moisture Sensitivity Level (MSL) 3 (per JEDEC J-STD-020) β€”
Floor Life at MSL3 168 hours (factory conditions < 30 C / 60% RH) β€”
Configuration Method JTAG / serial configuration flash β€”
Design Tool Altera Quartus β€”
RoHS Status [DATA_NEEDED: RoHS compliance per PCN] [DATA_NEEDED: RoHS status]
Lead-Free Reflow Compatible Yes (peak 220 C) β€”
Process Technology Altera APEX II CMOS programmable logic [DATA_NEEDED: process node]
Voltage Supply [DATA_NEEDED: VCCINT / VCCIO] β€”
Mounting Type Surface Mount Surface Mount (BGA)
Family β€” APEX II
Embedded Memory β€” 1.5 Mbit (ESB)
Maximum User I/O β€” [DATA_NEEDED: max user I/O count]
Number of PLLs β€” 4
Speed Grade β€” -7
Package β€” BGA-724 (724-ball FineLine BGA)
Package Footprint β€” 33 x 33 mm
Ball Pitch β€” 1.27 mm
MSL Level β€” [DATA_NEEDED: MSL level]
Configuration Mode β€” Enhanced configuration device / fast serial
I/O Standard Support β€” LVTTL / LVCMOS 1.5V, 1.8V, 2.5V, 3.3V

Datasheets & Resources

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