EP2A40F33I-7 vs EP2A40B724I-7 Vergleich

Detaillierter Direktvergleich von EP2A40F33I-7 von Intel und EP2A40B724I-7 von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2A40F33I-7 EP2A40B724I-7
Marke Intel Altera
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $119,00 $158,00
Device Family APEX II (EP2A) —
Device Member EP2A40 (high-density) —
Logic Elements [DATA_NEEDED: logic element count] 40,000 LE
Package Type Fine-pitch BGA (FBGA) —
Package Pin/Ball Count 33 balls —
Pitch [DATA_NEEDED: ball pitch] —
Operating Temperature Grade Industrial (-40 C to +85 C) Industrial (-40C to +100C)
Peak Reflow Temperature 220 C (Pb-free profile) 220 C
Feuchtigkeitsempfindlichkeitsgrad (MSL) 3 (per JEDEC J-STD-020) —
Floor Life at MSL3 168 hours (factory conditions < 30 C / 60% RH) —
Configuration Method JTAG / serial configuration flash —
Design Tool Altera Quartus —
RoHS-Status [DATA_NEEDED: RoHS compliance per PCN] [DATA_NEEDED: RoHS status]
Lead-Free Reflow Compatible Yes (peak 220 C) —
Process Technology Altera APEX II CMOS programmable logic [DATA_NEEDED: process node]
Voltage Supply [DATA_NEEDED: VCCINT / VCCIO] —
Montageart Surface Mount Surface Mount (BGA)
Family — APEX II
Embedded Memory — 1.5 Mbit (ESB)
Maximum User I/O — [DATA_NEEDED: max user I/O count]
Number of PLLs — 4
Speed Grade — -7
Gehäuse — BGA-724 (724-ball FineLine BGA)
Package Footprint — 33 x 33 mm
Ball Pitch — 1.27 mm
MSL-Level — [DATA_NEEDED: MSL level]
Configuration Mode — Enhanced configuration device / fast serial
I/O Standard Support — LVTTL / LVCMOS 1.5V, 1.8V, 2.5V, 3.3V

Datenblätter & Ressourcen

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