EP2A40F33I-7 vs EP2A40B724I-7 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2A40F33I-7 sa pamamagitan ng Intel at EP2A40B724I-7 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2A40F33I-7 EP2A40B724I-7
Brand Intel Altera
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Obsolete
Device Family APEX II (EP2A) —
Device Member EP2A40 (high-density) —
Logic Elements [DATA_NEEDED: logic element count] 40,000 LE
Package Type Fine-pitch BGA (FBGA) —
Package Pin/Ball Count 33 balls —
Pitch [DATA_NEEDED: ball pitch] —
Operating Temperature Grade Industrial (-40 C to +85 C) Industrial (-40C to +100C)
Peak Reflow Temperature 220 C (Pb-free profile) 220 C
Level ng Sensitivity sa Asid ng Moisture (MSL) 3 (per JEDEC J-STD-020) —
Floor Life at MSL3 168 hours (factory conditions < 30 C / 60% RH) —
Configuration Method JTAG / serial configuration flash —
Design Tool Altera Quartus —
Tindminan RoHS [DATA_NEEDED: RoHS compliance per PCN] [DATA_NEEDED: RoHS status]
Lead-Free Reflow Compatible Yes (peak 220 C) —
Process Technology Altera APEX II CMOS programmable logic [DATA_NEEDED: process node]
Voltage Supply [DATA_NEEDED: VCCINT / VCCIO] —
Uri ng Pagpapasok Surface Mount Surface Mount (BGA)
Family — APEX II
Embedded Memory — 1.5 Mbit (ESB)
Maximum User I/O — [DATA_NEEDED: max user I/O count]
Number of PLLs — 4
Speed Grade — -7
Packhaging — BGA-724 (724-ball FineLine BGA)
Package Footprint — 33 x 33 mm
Ball Pitch — 1.27 mm
Level ng MSL — [DATA_NEEDED: MSL level]
Configuration Mode — Enhanced configuration device / fast serial
I/O Standard Support — LVTTL / LVCMOS 1.5V, 1.8V, 2.5V, 3.3V

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