EP2A40F33I-7 vs EP2A40F33C-9 Comparison

Detailed side-by-side comparison of EP2A40F33I-7 by Intel and EP2A40F33C-9 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2A40F33I-7 EP2A40F33C-9
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $119.00 $78.00
Device Family APEX II (EP2A) β€”
Device Member EP2A40 (high-density) β€”
Logic Elements [DATA_NEEDED: logic element count] [DATA_NEEDED: exact LE count]
Package Type Fine-pitch BGA (FBGA) β€”
Package Pin/Ball Count 33 balls β€”
Pitch [DATA_NEEDED: ball pitch] β€”
Operating Temperature Grade Industrial (-40 C to +85 C) β€”
Peak Reflow Temperature 220 C (Pb-free profile) 220 C
Moisture Sensitivity Level (MSL) 3 (per JEDEC J-STD-020) β€”
Floor Life at MSL3 168 hours (factory conditions < 30 C / 60% RH) β€”
Configuration Method JTAG / serial configuration flash JTAG, serial PROM, parallel flash
Design Tool Altera Quartus β€”
RoHS Status [DATA_NEEDED: RoHS compliance per PCN] [DATA_NEEDED: not stated in provided data]
Lead-Free Reflow Compatible Yes (peak 220 C) β€”
Process Technology Altera APEX II CMOS programmable logic 0.15 micrometer CMOS
Voltage Supply [DATA_NEEDED: VCCINT / VCCIO] β€”
Mounting Type Surface Mount Surface Mount (BGA)
Family β€” APEX II
Maximum System Gates β€” 1,600,000
Embedded RAM β€” 65 Kbytes (approximately 540 Kbits depending on configuration)
Package β€” 672-ball FineLine BGA (F33), 1.27 mm pitch
Speed Grade β€” -9
Operating Temperature β€” 0C to +85C (commercial)
PLLs β€” 4
LVDS Channels β€” 16 high-speed LVDS channels
Maximum User I/O β€” [DATA_NEEDED: max user I/O count]
Multi-Core Architecture β€” MegaLAB structure with embedded memory and CAM
MSL Level β€” 3
Core Voltage β€” [DATA_NEEDED: nominal core voltage]

Datasheets & Resources

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