EP2A40F33I-7 vs EP2A40F33C-9 比較

詳細並排比較 EP2A40F33I-7 由 Intel 與 EP2A40F33C-9 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP2A40F33I-7 EP2A40F33C-9
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 Obsolete NRND
Device Family APEX II (EP2A) —
Device Member EP2A40 (high-density) —
Logic Elements [DATA_NEEDED: logic element count] [DATA_NEEDED: exact LE count]
Package Type Fine-pitch BGA (FBGA) —
Package Pin/Ball Count 33 balls —
Pitch [DATA_NEEDED: ball pitch] —
Operating Temperature Grade Industrial (-40 C to +85 C) —
Peak Reflow Temperature 220 C (Pb-free profile) 220 C
濕度敏感等級 (MSL) 3 (per JEDEC J-STD-020) —
Floor Life at MSL3 168 hours (factory conditions < 30 C / 60% RH) —
Configuration Method JTAG / serial configuration flash JTAG, serial PROM, parallel flash
Design Tool Altera Quartus —
RoHS 狀態 [DATA_NEEDED: RoHS compliance per PCN] [DATA_NEEDED: not stated in provided data]
Lead-Free Reflow Compatible Yes (peak 220 C) —
Process Technology Altera APEX II CMOS programmable logic 0.15 micrometer CMOS
Voltage Supply [DATA_NEEDED: VCCINT / VCCIO] —
安裝類型 Surface Mount Surface Mount (BGA)
Family — APEX II
Maximum System Gates — 1,600,000
Embedded RAM — 65 Kbytes (approximately 540 Kbits depending on configuration)
封裝 — 672-ball FineLine BGA (F33), 1.27 mm pitch
Speed Grade — -9
工作溫度 — 0C to +85C (commercial)
PLLs — 4
LVDS Channels — 16 high-speed LVDS channels
Maximum User I/O — [DATA_NEEDED: max user I/O count]
Multi-Core Architecture — MegaLAB structure with embedded memory and CAM
MSL 等級 — 3
Core Voltage — [DATA_NEEDED: nominal core voltage]

資料表與資源

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