EP2A70B724C7 vs EP2A70B724I-7 Comparison

Detailed side-by-side comparison of EP2A70B724C7 by Intel and EP2A70B724I-7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2A70B724C7 EP2A70B724I-7
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Unknown Obsolete
Device Type FPGA (Field Programmable Gate Array) —
Family APEX II APEX II
Gate Count 3,000,000 gates —
Logic Cells 67,200 cells —
I/O Count 540 I/O —
Configuration or Memory Capacity [DATA_NEEDED: exact embedded-memory or configuration-memory capacity] —
Supply Voltage 1.5 V —
Maximum Frequency 420 MHz —
Fabrication Process 0.15 µm —
Loadable PLD Timing 2.17 ns —
Technology CMOS —
Package 724-pin FCBGA, 724-BBGA, or PBGA724 BGA-724
Package Body Size 35 mm x 35 mm —
Package Pitch 1.27 mm —
Interface Capabilities True-LVDS, LVPECL, PCML, and HyperTransport —
RoHS Status unknown [DATA_NEEDED: RoHS]
REACH Status unknown —
AEC-Q100 Status unknown —
Lead-Free Status unknown —
Operating Temperature [DATA_NEEDED: operating-temperature range] —
Logic Elements — 70,000 (EP2A70 family variant)
Typical Gates — [DATA_NEEDED: typical gate count]
Maximum User I/O — [DATA_NEEDED: max user I/O]
Embedded System Blocks — [DATA_NEEDED: ESB count]
Temperature Grade — Industrial
Speed Grade — -7
Supply Voltage (Core) — [DATA_NEEDED: core VCC]
I/O Standards — LVTTL, LVCMOS, PCI, SSTL, GTL+
Configuration Interface — JTAG (IEEE 1149.1), Passive Serial, Active Serial
Process Technology — CMOS
Mounting Type — Surface Mount (BGA)
Peak Reflow Temperature — 220 C

Datasheets & Resources

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