EP2A70B724C7 vs EP2A70B724I-7 Comparaison
Comparaison détaillée côte à côte de EP2A70B724C7 par Intel et EP2A70B724I-7 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2A70B724C7 | EP2A70B724I-7 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Unknown | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $0,00 | $245,00 |
| Device Type | FPGA (Field Programmable Gate Array) | — |
| Family | APEX II | APEX II |
| Gate Count | 3,000,000 gates | — |
| Logic Cells | 67,200 cells | — |
| I/O Count | 540 I/O | — |
| Configuration or Memory Capacity | [DATA_NEEDED: exact embedded-memory or configuration-memory capacity] | — |
| Tension d'alimentation | 1.5 V | — |
| Maximum Frequency | 420 MHz | — |
| Fabrication Process | 0.15 µm | — |
| Loadable PLD Timing | 2.17 ns | — |
| Technology | CMOS | — |
| Boîtier | 724-pin FCBGA, 724-BBGA, or PBGA724 | BGA-724 |
| Package Body Size | 35 mm x 35 mm | — |
| Package Pitch | 1.27 mm | — |
| Interface Capabilities | True-LVDS, LVPECL, PCML, and HyperTransport | — |
| Statut RoHS | unknown | [DATA_NEEDED: RoHS] |
| REACH Status | unknown | — |
| AEC-Q100 Status | unknown | — |
| Lead-Free Status | unknown | — |
| Température de fonctionnement | [DATA_NEEDED: operating-temperature range] | — |
| Logic Elements | — | 70,000 (EP2A70 family variant) |
| Typical Gates | — | [DATA_NEEDED: typical gate count] |
| Maximum User I/O | — | [DATA_NEEDED: max user I/O] |
| Embedded System Blocks | — | [DATA_NEEDED: ESB count] |
| Temperature Grade | — | Industrial |
| Speed Grade | — | -7 |
| Supply Voltage (Core) | — | [DATA_NEEDED: core VCC] |
| I/O Standards | — | LVTTL, LVCMOS, PCI, SSTL, GTL+ |
| Configuration Interface | — | JTAG (IEEE 1149.1), Passive Serial, Active Serial |
| Process Technology | — | CMOS |
| Type de montage | — | Surface Mount (BGA) |
| Peak Reflow Temperature | — | 220 C |