EP2A70F1508I-9 vs EP2A70F1508I9 Comparison

Detailed side-by-side comparison of EP2A70F1508I-9 by Intel and EP2A70F1508I9 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2A70F1508I-9 EP2A70F1508I9
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last Time Buy Obsolete
Family APEX II (EP2A) APEX II
Device Logic Elements [DATA_NEEDED: exact LE count] —
Typical Gates 70,000 —
Maximum User I/O Pins [DATA_NEEDED: maximum user I/O] —
Maximum User Memory Bits [DATA_NEEDED: embedded RAM bits] —
Package 1508-ball FBGA (FineLine BGA) —
Process Technology 0.18 um CMOS, SRAM-based 0.15 µm
Speed Grade -9 (fastest APEX II speed grade) 9 (highest within APEX II family)
Operating Temperature -40C to +100C (Industrial, suffix I) —
Configuration Method SRAM-based, in-system reprogrammable —
On-chip Memory Embedded System Blocks (ESBs) - dual-port RAM/ROM —
I/O Standards Supported LVTTL, LVCMOS, PCI, SSTL, HSTL, LVDS, LVPECL —
Differential I/O True-LVDS capable —
PLL Count [DATA_NEEDED: PLL count] Multiple (per datasheet)
Moisture Sensitivity Level (MSL) 3 —
Peak Reflow Temperature 220 C —
RoHS Status [DATA_NEEDED: RoHS compliance per data] unknown
Design Software Quartus II (legacy APEX II support) —
Series — EP2A
Logic Elements / Cells — 67200
Total System Gates — 3 M
Maximum Internal Clock Frequency — 198 MHz
Core Supply Voltage (VCCINT) — 1.5 V
Number of Pins — 1508
Package Type — FC-FBGA (Flip-Chip Fine-pitch Ball Grid Array)
Mounting Type — Surface Mount
Operating Temperature Grade — Industrial (I)
Embedded System Blocks (ESB) — Yes (dual-port RAM, FIFO, CAM)
Configuration Modes — PPS, PPA, PS, JTAG (IEEE 1149.1)

Datasheets & Resources

Browse All Products Create BOM Request Quote