EP2A70F1508I-9 vs EP2A70F1508I9 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2A70F1508I-9 sa pamamagitan ng Intel at EP2A70F1508I9 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2A70F1508I-9 - APEX II FPGA 70K LE, FBGA-1508 | Altera / Intel
EP2A70F1508I-9 ⚠ Huling Pagbili
Pagsanggunian na paghahambing
| Parametro | EP2A70F1508I-9 | EP2A70F1508I9 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Obsolete |
| Family | APEX II (EP2A) | APEX II |
| Device Logic Elements | [DATA_NEEDED: exact LE count] | — |
| Typical Gates | 70,000 | — |
| Maximum User I/O Pins | [DATA_NEEDED: maximum user I/O] | — |
| Maximum User Memory Bits | [DATA_NEEDED: embedded RAM bits] | — |
| Packhaging | 1508-ball FBGA (FineLine BGA) | — |
| Process Technology | 0.18 um CMOS, SRAM-based | 0.15 µm |
| Speed Grade | -9 (fastest APEX II speed grade) | 9 (highest within APEX II family) |
| Temperature na Operasyon | -40C to +100C (Industrial, suffix I) | — |
| Configuration Method | SRAM-based, in-system reprogrammable | — |
| On-chip Memory | Embedded System Blocks (ESBs) - dual-port RAM/ROM | — |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, SSTL, HSTL, LVDS, LVPECL | — |
| Differential I/O | True-LVDS capable | — |
| PLL Count | [DATA_NEEDED: PLL count] | Multiple (per datasheet) |
| Level ng Sensitivity sa Asid ng Moisture (MSL) | 3 | — |
| Peak Reflow Temperature | 220 C | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance per data] | unknown |
| Design Software | Quartus II (legacy APEX II support) | — |
| Series | — | EP2A |
| Logic Elements / Cells | — | 67200 |
| Total System Gates | — | 3 M |
| Maximum Internal Clock Frequency | — | 198 MHz |
| Core Supply Voltage (VCCINT) | — | 1.5 V |
| Bilang ng Pins | — | 1508 |
| Package Type | — | FC-FBGA (Flip-Chip Fine-pitch Ball Grid Array) |
| Uri ng Pagpapasok | — | Surface Mount |
| Operating Temperature Grade | — | Industrial (I) |
| Embedded System Blocks (ESB) | — | Yes (dual-port RAM, FIFO, CAM) |
| Configuration Modes | — | PPS, PPA, PS, JTAG (IEEE 1149.1) |