EP2AGX45DF29C6N vs EP2AGX45DF29I3NAD Comparison
Detailed side-by-side comparison of EP2AGX45DF29C6N by Intel and EP2AGX45DF29I3NAD by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP2AGX45DF29C6N
EP2AGX45DF29C6N - Arria II GX FPGA 45K LE 780-FBGA | Intel
EP2AGX45DF29C6N NrndIntel
EP2AGX45DF29I3NAD
EP2AGX45DF29I3NAD - 42K LE Arria II GX FPGA 780-FBGA | Intel
EP2AGX45DF29I3NAD β ActiveSpecification Comparison
| Parameter | EP2AGX45DF29C6N | EP2AGX45DF29I3NAD |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $175.00 | $285.10 |
| Device Family | Arria II GX | β |
| Logic Elements | 45,000 | 42,959 |
| Number of LABs | 1,805 | β |
| Embedded Memory Bits | 3,517,440 bits | β |
| Total Block Memory Bits | [DATA_NEEDED: dedicated block memory bits] | β |
| User I/O Count | 364 | β |
| Maximum Transceiver Data Rate | 6.375 Gbps | β |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | β |
| Core Voltage | 0.9 V | [DATA_NEEDED: VCCINT typical value] |
| Process Technology | 40 nm | β |
| Package | 780-FBGA (DF29), 29 mm body | 780-ball FBGA (FineLine BGA) |
| Operating Temperature | 0C to +85C (commercial) | β |
| Speed Grade | C6 | I3 (industrial, -40C to +100C junction, fastest speed bin in the I grade) |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| RoHS Status | Compliant | [DATA_NEEDED: rohs status] |
| Pb-Free / Lead-Free | Yes | β |
| Family | β | Arria II GX |
| Logic Array Blocks (LABs) | β | 1,805 |
| Embedded RAM Bits | β | 3,517,440 |
| User I/Os | β | 364 |
| Process Node | β | 40 nm |
| Transceivers | β | Multi-gigabit transceivers integrated |
| Transceiver Data Rate | β | 600 Mbps to 6.375 Gbps |
| Multipliers (18x18) | β | 156 (typical) |
| Temperature Grade | β | Industrial (I) |