EP2AGX45DF29C6N vs EP2AGX45DF29I3NAD Comparaison
Comparaison détaillée côte à côte de EP2AGX45DF29C6N par Intel et EP2AGX45DF29I3NAD par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2AGX45DF29C6N | EP2AGX45DF29I3NAD |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $175,00 | $285,10 |
| Device Family | Arria II GX | — |
| Logic Elements | 45,000 | 42,959 |
| Number of LABs | 1,805 | — |
| Embedded Memory Bits | 3,517,440 bits | — |
| Total Block Memory Bits | [DATA_NEEDED: dedicated block memory bits] | — |
| User I/O Count | 364 | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | — |
| Core Voltage | 0.9 V | [DATA_NEEDED: VCCINT typical value] |
| Process Technology | 40 nm | — |
| Boîtier | 780-FBGA (DF29), 29 mm body | 780-ball FBGA (FineLine BGA) |
| Température de fonctionnement | 0C to +85C (commercial) | — |
| Speed Grade | C6 | I3 (industrial, -40C to +100C junction, fastest speed bin in the I grade) |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Statut RoHS | Compliant | [DATA_NEEDED: rohs status] |
| Pb-Free / Lead-Free | Yes | — |
| Family | — | Arria II GX |
| Logic Array Blocks (LABs) | — | 1,805 |
| Embedded RAM Bits | — | 3,517,440 |
| User I/Os | — | 364 |
| Process Node | — | 40 nm |
| Transceivers | — | Multi-gigabit transceivers integrated |
| Transceiver Data Rate | — | 600 Mbps to 6.375 Gbps |
| Multipliers (18x18) | — | 156 (typical) |
| Temperature Grade | — | Industrial (I) |