EP2AGX45DF29C6N vs EP2AGX45DF29I3NAD Comparación
Comparación detallada lado a lado de EP2AGX45DF29C6N por Intel y EP2AGX45DF29I3NAD por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGX45DF29C6N | EP2AGX45DF29I3NAD |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $175,00 | $285,10 |
| Device Family | Arria II GX | — |
| Logic Elements | 45,000 | 42,959 |
| Number of LABs | 1,805 | — |
| Embedded Memory Bits | 3,517,440 bits | — |
| Total Block Memory Bits | [DATA_NEEDED: dedicated block memory bits] | — |
| User I/O Count | 364 | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | — |
| Core Voltage | 0.9 V | [DATA_NEEDED: VCCINT typical value] |
| Process Technology | 40 nm | — |
| Encapsulado | 780-FBGA (DF29), 29 mm body | 780-ball FBGA (FineLine BGA) |
| Temperatura de funcionamiento | 0C to +85C (commercial) | — |
| Speed Grade | C6 | I3 (industrial, -40C to +100C junction, fastest speed bin in the I grade) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | Compliant | [DATA_NEEDED: rohs status] |
| Pb-Free / Lead-Free | Yes | — |
| Family | — | Arria II GX |
| Logic Array Blocks (LABs) | — | 1,805 |
| Embedded RAM Bits | — | 3,517,440 |
| User I/Os | — | 364 |
| Process Node | — | 40 nm |
| Transceivers | — | Multi-gigabit transceivers integrated |
| Transceiver Data Rate | — | 600 Mbps to 6.375 Gbps |
| Multipliers (18x18) | — | 156 (typical) |
| Temperature Grade | — | Industrial (I) |